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Advantest Installs T2000 Integrated Power Device Test Solution at Toyota Motor for Evaluating Integrated Power ICs

Leading semiconductor test equipment supplier Advantest Corporation has installed its T2000 Integrated Power Device Test Solution (IPS) at Toyota Motor Corporation for evaluating and mass-producing integrated power ICs used in next-generation hybrid cars.

3 Dec 2013

NXP Enters JV with Datang Telecom to Establish Chinese Automotive Semiconductor Company

NXP Semiconductors N.V. and DATANG TELECOM TECHNOLOGY CO., LTD today announced the establishment of a joint venture (JV), the first true automotive semiconductor company in China. The JV will focus on developing and marketing semiconductor solutions for the domestic hybrid and electric car market, a top priority in the latest five-year plan of the Chinese government.

From NXP Semiconductors 3 Dec 2013

‘Dual-Electrode Photoelectrochemistry’ Provides New Insight into How Solar Water-Splitting Cells Work

With the help of a new method called "dual-electrode photoelectrochemistry," University of Oregon scientists have provided new insight into how solar water-splitting cells work. An important and overlooked parameter, they report, is the ion-permeability of electrocatalysts used in water-splitting devices.

3 Dec 2013

ADA Foundation Receives NIDCR Grant to Develop New Resin Composite Dental Fillings

The American Dental Association and the ADA Foundation today announced that the foundation's Anthony Volpe Research Center (VRC) received a five-year, $2.2 million grant from the National Institute of Dental and Craniofacial Research (NIDCR) to develop new resin composite dental fillings. The grant started on Sept. 1 and the first year's funding is $450,000. NIDCR is a part of the National Institutes of Health.

3 Dec 2013

Antennas and Solar Cells Combined to Work Together with Unprecedented Efficiency

Researchers at EPFL have managed to combine antennas and solar cells to work together with unprecedented efficiency in a near future. This is a first step towards more compact and more lightweight satellites. The technology could also be deployed in the autonomous antenna systems used in the aftermath of natural disasters.

3 Dec 2013

RS Offers RepRap Ormerod Complete 3D Printing Kit

RS Components (RS), the trading brand of Electrocomponents plc, the world's leading high service distributor of electronics and maintenance products, has signed a landmark distribution agreement with RepRapPro Ltd that will deliver affordable, open-source, self-replicating 3D printing technology to engineers worldwide. The completion of the deal coincides with the launch of the RepRapPro Ormerod low cost 3D printer, which is available first from RS.

From RS Components Ltd. 3 Dec 2013

Researchers Produce Half-Heusler Compounds for Thermoelectric Processes More Efficiently and Cost-Effectively

Half-Heusler compounds are especially suited for manufacturing thermoelectric modules. Waste heat can be converted to electricity with them. Researchers have manufactured the alloys for the first time in kilogram quantities.

2 Dec 2013

New Report on Global Market for Motor Vehicle Bumpers

Research and Markets has announced the addition of the "Global Market for Motor Vehicle Bumpers to 2017 - Market Size, Growth and Forecasts in Over 60 Countries" report to their offering.

From Research and Markets 2 Dec 2013

Laser Metal Deposition Increases Lifetime of Forming Dies for Automotive Manufacturing

Forming dies are put under immense strain. Yet by using a laser to alloy their surfaces with filler material you can make them more robust and resistant to wear. This process increases the service life of dies used in automotive manufacturing by 150 percent.

2 Dec 2013

Taylor Hobson Introduce Surtronic S-100 - Robust Portable Roughness Tester

A portable roughness tester with robustness, versatility and extensive connectivity to support a wide range of surface measurement applications has been introduced by AMETEK Taylor Hobson.

From Taylor Hobson 2 Dec 2013

USHIO Installs Projection Aligner for 2.5D Glass Substrate Development at Georgia Tech 3D Systems Packaging Research Center

USHIO INC., (President and CEO: Shiro Sugata) today announced that the company installed one unit of a projection aligner dedicated to developing 2.5D glass substrate at the Georgia Tech 3D Systems Packaging Research Center (GT-PRC) on October 31 in 2013, based on conclusion of the partnership agreement related to the interposer development consortium sponsored by GT-PRC. USHIO has already dispatched its engineer and started supporting development of lower-cost glass interposers and packages.

2 Dec 2013

CDP Lists UMC on Climate Performance and Climate Disclosure Leadership Indexes

United Microelectronics Corporation ("UMC" or "The Company"), a leading global semiconductor foundry, today announced that the company has been honored as the first Taiwanese corporation to be listed as a Climate Performance Leadership Index (CPLI) component by Carbon Disclosure Project (CDP). The foundry was also concurrently listed on CDP's Climate Disclosure Leadership Index (CDLI).

2 Dec 2013

Benchmade Knife Wins Second-Annual American Made Outdoor Gear Award

Benchmade Knife Company (www.benchmade.com) today was named the overall winner of the second-annual American Made Outdoor Gear Award.

2 Dec 2013

Growing Demand in Emerging Economies Drive Global Epoxy Resins Market

Research and Markets has announced the addition of the "Global Epoxy Resins Market, 2016" report to their offering.

From Research and Markets 2 Dec 2013

Bauminas Acquires Kemira’s Brazilian Iron and Aluminium Coagulant Business

Kemira and Bauminas have signed a contract today according to which Kemira sells its Brazilian iron and aluminium coagulant business to Bauminas. The deal includes coagulant business related assets, liabilities and personnel of Kemira WaterSolutions Brazil Ltda and shares of Nheel Quimica Ltda as well as its three coagulants manufacturing sites in Brazil (Rio Claro, Araporti and Lages).

2 Dec 2013

Materials Science News

Advantest Installs T2000 Integrated Power Device Test Solution at Toyota Motor for Evaluating Integrated Power ICs

NXP Enters JV with Datang Telecom to Establish Chinese Automotive Semiconductor Company

‘Dual-Electrode Photoelectrochemistry’ Provides New Insight into How Solar Water-Splitting Cells Work

ADA Foundation Receives NIDCR Grant to Develop New Resin Composite Dental Fillings

Antennas and Solar Cells Combined to Work Together with Unprecedented Efficiency

RS Offers RepRap Ormerod Complete 3D Printing Kit

Researchers Produce Half-Heusler Compounds for Thermoelectric Processes More Efficiently and Cost-Effectively

New Report on Global Market for Motor Vehicle Bumpers

Laser Metal Deposition Increases Lifetime of Forming Dies for Automotive Manufacturing

Taylor Hobson Introduce Surtronic S-100 - Robust Portable Roughness Tester

USHIO Installs Projection Aligner for 2.5D Glass Substrate Development at Georgia Tech 3D Systems Packaging Research Center

CDP Lists UMC on Climate Performance and Climate Disclosure Leadership Indexes

Benchmade Knife Wins Second-Annual American Made Outdoor Gear Award

Growing Demand in Emerging Economies Drive Global Epoxy Resins Market

Bauminas Acquires Kemira’s Brazilian Iron and Aluminium Coagulant Business

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