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Plasma Treatment May Help Overcome Challenges of Conformal Coating

Nordson MARCH, a Nordson Company, a global leader in plasma processing technology, will present the paper “Overcoming the Challenges Presented with Automated Selective Conformal Coating of Advanced Electronic Assemblies by Employing Plasma Treatment Technology,” by David Foote, global applications manager, Nordson MARCH, at SMTA International 2013, Fort Worth, TX, Tuesday, October 15, from 4:00–5:30 PM, in Technical Session MFX3, Room 202D.

From Nordson MARCH 11 Oct 2013

Eaton’s Worksop Manufacturing Plant Wins Energy & Environment Best Factory Award

Power management company Eaton is delighted to announce that its manufacturing plant in Worksop, United Kingdom, has won the Energy & Environment category at this year’s Best Factory Awards. The awards were presented at a ceremony held in London on 27th September, and additionally saw Eaton being Highly Commended for its plant in the highly regarded Best Electronics & Electrical Plant category.

From Eaton Corporation 11 Oct 2013

Novelis Expands Yeongju and Ulsan Aluminum Rolling Plants in South Korea

Novelis, the world leader in aluminum rolling and recycling, announced today the completion of a two-year, $400 million expansion program in South Korea. The expansion of its Yeongju and Ulsan plants increases the company's production capacity in the region by more than 50 percent to approximately one million metric tons of aluminum sheet per year.

From Novelis Corp 11 Oct 2013

Global Chromatography Instrumentation Market Forecast to Grow at 5.7% CAGR from 2013 to 2018

The "Chromatography Instrumentation Market by Systems [LC (HPLC, UHPLC, FLASH), GC, TLC, SFC, Others (Autosamplers, Detectors, Fraction collectors)], By Consumables (Reverse phase columns, Syringe filters, Vials) & Industry - Global Forecast to 2018", analyzes and studies the major market drivers, restraints, opportunities, and challenges in North America, Europe, Asia, and Rest of the World.

11 Oct 2013

Fluke Introduces New Hydraulic Deadweight Testers for Pressure Calibration

Fluke Calibration announces the addition of three new models to its P3100 Hydraulic Deadweight Tester line of pressure calibrators. The new testers extend the P3125 oil-operated, dual PCU product line, allowing users to calibrate more devices with one instrument. The P3125XT-BAR measures from 1 to1200 bar, the P3125XT-KGCM2 from 1 to 1200 kgf/cm2, and the P3125XT-MPA from 1 to 120 MPa.

From Fluke Corporation 11 Oct 2013

MakerBot CEO Joins in ‘America Makes’ Rebranding Announcement

Bre Pettis, CEO of MakerBot, and the global leader in the desktop 3D printing industry, was the featured guest speaker at this week’s meeting of the National Additive Manufacturing Innovation Institute, formerly known as NAMII, and now known as America Makes, held October 8, 2013, in Youngstown, Ohio.

11 Oct 2013

New Low-Voiding Flux Coating for Solder Preforms from Indium

Indium Corporation introduces a new,high-reliability, low-voiding flux coating for solder preforms. LV1000 reduces false failures while increasing productivity, throughput yields, and component performance. This new halide-free (ROL0)materialis especially suited for assembly processesin which the components don’t allow for proper outgassing of volatized flux.

11 Oct 2013

Pultruded Fiberglass Siding and Trim Help Protect Against Superstorms

As the East Coast continues to climb out of the tragic damage caused by last year's Superstorm Sandy, many homeowners are wondering if there's a better alternative to the wood, vinyl, fiber cement, and aluminum siding products that experienced significant damage from the pounding rain, high winds, blowing sand produced by Sandy.

11 Oct 2013

New Tin-Silver Plating Chemistry for Lead-Free Bump Plating Launched by Dow

Dow Electronic Materials, a business unit of The Dow Chemical Company, today announced availability of its SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry for use in lead-free solder bump plating applications. This next-generation formulation features enhanced plating performance, bath stability and ease-of-use, thereby enabling the industry's widest process window with the most robust process flexibility and a competitive cost of ownership (COO).

From Dow Chemicals 11 Oct 2013

IMPACT Conference: Indium Technology Expert to Discuss Newly-Developed Epoxy Flux

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present at the International Microsystems Packaging Assembly and Circuits Technology conference (IMPACT) on Thursday, October 24 in Taipei, Taiwan.

11 Oct 2013

2013 Julius Springer Prize for Applied Physics Awarded to Sir John Pendry for Metamaterial Research

This year’s Julius Springer Prize for Applied Physics will be awarded to Sir John Pendry, one of the world’s leading condensed matter theorists. His revolutionary work on metamaterials has opened the doors to...

From Springer - Science and Technology Publishers 10 Oct 2013

New Publication by Woodhead Publishing looks at the Structure and Applications of Biomimetic Biomaterials

A significant proportion of modern medical technology has been developed through biomimetics, that is biologically inspired by studying pre-existing functioning systems in nature.

10 Oct 2013

New Panalytical Live Webinar On Hydrogen Storage

PANalytical announce their latest web seminar regarding new data on Hydrogen storage which will be of great interest to those in associated scientific fields, such as battery development, academia and government entities...

10 Oct 2013

Siemens Advances Simit Simulation Framework for Virtual Commissioning of Simatic-Based Automation Solutions

The Siemens Industry Automation Division has equipped the Simit simulation framework for the virtual commissioning of Simatic-based automation solutions with new functions in version 7.1. The Simit Contec library was added to the pre-assembled software components and models.

10 Oct 2013

New High-Performance Thermally Conductive Adhesives for Automotive Electronics Applications from Dow Corning

Dow Corning®, a global leader in silicones, silicon-based technology and innovation, announced today at Bondexpo two new thermally conductive adhesives developed to enable design of more compact, reliable and higher performing automotive electronics assemblies.

From Dow Corning 10 Oct 2013