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Avnet Embedded Announces Launch of Open Compute Project Innovation Labs

Avnet Embedded, a division of Avnet Electronics Marketing Americas, a business region of Avnet, Inc. (NYSE: AVT), today announced the launch of its Open Compute Project (OCP) Innovation Labs. These OCP Innovation Labs will serve as both technology showcases and development labs for users, developers and partners to design, deliver and integrate cost-effective, power-efficient compute, storage and networking solutions.

17 Jan 2013

University of Manchester and Electricity Producer EDF Enter Global Framework Agreement

The agreement, between EDF R&D, EDF Energy and the University’s Dalton Nuclear Institute, was signed in a joint meeting with Bernard Salha (Senior Vice President of EDF SA, President of EDF Research and Development), Paul Spence (EDF Energy Director of Strategy and Corporate Affairs) and Professor Colin Bailey (Vice-President and Dean of the Faculty of Engineering and Physical Sciences).

17 Jan 2013

Qualcomm Releases Quad-Core Chips with Long-Term Evolution Support

Immediately after the announcement of rival chipmaker NVIDIA's highly anticipated successor to Tegra 3 chip, the six times as powerful Tegra 4, segment leader Qualcomm, Inc. [Full Research Report](1) released its own set of quad-core chips with long-term evolution (LTE) support, coming as a surprise to some -the company's first offering of this kind.

17 Jan 2013

New Handbook on Terahertz Technology for Imaging, Sensing and Communications

The recent development of easy-to-use sources and detectors of terahertz radiation has enabled growth in applications of terahertz (Thz) imaging and sensing. This vastly adaptable technology offers great potential across a wide range of areas, and the Handbook of terahertz technology for imaging, sensing and communications explores the fundamental principles, important developments and key applications emerging in this exciting field.

17 Jan 2013

MEMC Launches High-Efficiency Silvantis M330 Solar Module

MEMC Electronic Materials, today introduced the MEMC Silvantis™ M330 Solar Module. The Silvantis M330 is the first product to be manufactured exclusively with MEMC-produced polysilicon and CCz p-type mono wafers leveraging the company's strategic vertical integration.

17 Jan 2013

Superomniphobic Surfaces Repel both Newtonian and Non-Newtonian Liquids

In an advance toward stain-proof, spill-proof clothing, protective garments and other products that shrug off virtually every liquid — from blood and ketchup to concentrated acids — scientists are reporting development of new "superomniphobic" surfaces. Their report on surfaces that display extreme repellency to two families of liquids — Newtonian and non-Newtonian liquids — appears in the Journal of the American Chemical Society.

17 Jan 2013

Imec and PVA Tepla Report Breakthrough Results in TSV Void Detection in 3D Stacked IC Technology

Imec and PVA Tepla present breakthrough results in the detection of TSV voids in 3D stacked IC technology. After having applied Scanning Acoustic Microscopy to temporary wafer (de)bonding inspection, they successfully used new advanced GHz SAM technology to detect TSV voids at wafer-level after TSV Copper plating. Together, they will continue to investigate the applicability of high-frequency scanning acoustic microscopy for non-destructive submicron void detection.

From IMEC 17 Jan 2013

IPC APEX EXPO: EVS to Showcase New Lead-Free Solder Recovery System

EVS International, the leader in solder recovery, will introduce the newest system in its award-winning EVS series, the new EVS 8K LFHS Lead-Free Solder Recovery System, in distributor Sono-Tek’s Booth #3400 at the upcoming IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center.

17 Jan 2013

AREVA’s Georges Besse II Enrichment Plant Meets New Milestone

Georges Besse II, AREVA’s new enrichment plant inaugurated in December 2010, met a new milestone end of 2012 with more than 2.5 million separative work units (SWU) per year of installed production capacity reached, in line with the original project schedule.

17 Jan 2013