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Nordson MARCH MesoSPHERE Plasma Systems Enable Very High Throughput Processing for 3D and Wafer-level Package Assembly

The MesoSPHERE™ Plasma System optimizes wafer cleaning and etching processes, delivering consistent results with advanced plasma processing capabilities.

From Nordson MARCH 1 Feb 2018

Michelman Innovation Centre for Coatings is Creating the Future of Packaging in India

Michelman opens the Innovation Centre for Coatings in Mumbai, enhancing sustainable packaging development with state-of-the-art technology and expertise.

From Michelman Inc 25 Jan 2018

Investigations are Ongoing to Find the Optimal Next-Generation Bioplastics

The innovation under progress in the field of packaging is making products entirely using organic materials acquired from the remnants of agricultural production. A specialist at the Italian National Research Council (CNR) stated that such bioplastics might be as competitive as conventional ones in the early 2020s, although they might not be applicable in all fields.

5 Jul 2017

See Coherent | Rofin for Innovative Solutions for Product Packaging at Interpack 2017

Coherent will showcase several innovative solutions for packaging at Interpack 2017. The new StarPack CW Hybrid addresses needs current needs in roll-to-roll processing with industry-leading features to address a broad range of packaging applications, such as cross web and web direction scribing and perforating.

2 May 2017

Aquapak Polymers Receives CleanTech Award for Flexible Plastic Packaging Films

Birmingham-based plastics manufacturer Aquapak Polymers has won a CleanTech award for ‘Responsible Product’ at this year’s Rushlight Awards.

6 Feb 2017

Arabplast 2017: Efficient Production of Packaging Items

From 8 to 10 January 2017, Arburg will be presenting its new electric entry-level machine series in the Middle East for the first time, at the Arabplast 2017 in Dubai (United Arab Emirates): an Allrounder 570 E Golden Electric will produce closure caps for drinking yoghurt bottles on stand D110 in Hall 5. Thanks to its consistent standardisation, the electric entry-level machine offers an excellent price/performance ratio.

From Arburg GmbH 22 Nov 2016

K 2016: Coperion Introduces FFS Packaging Machine ITL 250 with Automated Features

Coperion introduces the latest developments in its bagging and palletizing portfolio at K 2016 at its booth B19 in hall 14. Visitors will be able to see the completely re-designed FFS packaging machine ITL 250.

From Coperion GmbH 3 Oct 2016

Cadence Announces Availability of Integrated System Design Solution for TSMC’s InFO Packaging Technology

Cadence Design Systems, Inc. today announced the immediate availability of an integrated system design solution for TSMC’s advanced wafer-level Integrated Fan-Out (InFO) packaging technology, resulting from a collaboration between Cadence and TSMC that was announced earlier this year.

22 Sep 2016

Michelman to Highlight Printing and Coating Technologies at 5th Specialty Films & Flexible Packaging Conference

Michelman will present a variety of its flagship print receptive and functional coating technologies at the 5th Specialty Films & Flexible Packaging Conference being held September 21-22 in Mumbai, India.

22 Sep 2016

Building On a Database of More Than 20,000 Results: HAVER&BOECKER Reveals the Value of The FT4 Powder Rheometer For Developing High Performance Packaging Solutions.

HAVER&BOECKER, a leading developer and producer of screening and packing machines for the processing industries, has revealed the pivotal role that dynamic testing with the FT4 Powder Rheometer® plays in ensuring the delivery of optimal, low risk packaging solutions. Furthermore, with a decade of testing in place, at a rate of around 1000 products per year, the company is comfortably secure in its reliance on the instrument; reliability remains consistently high and maintenance requirements are minimal.

22 Sep 2016

Editorial Highlights

Packaging News

Nordson MARCH MesoSPHERE Plasma Systems Enable Very High Throughput Processing for 3D and Wafer-level Package Assembly

Michelman Innovation Centre for Coatings is Creating the Future of Packaging in India

Investigations are Ongoing to Find the Optimal Next-Generation Bioplastics

See Coherent | Rofin for Innovative Solutions for Product Packaging at Interpack 2017

Aquapak Polymers Receives CleanTech Award for Flexible Plastic Packaging Films

Arabplast 2017: Efficient Production of Packaging Items

K 2016: Coperion Introduces FFS Packaging Machine ITL 250 with Automated Features

Cadence Announces Availability of Integrated System Design Solution for TSMC’s InFO Packaging Technology

Michelman to Highlight Printing and Coating Technologies at 5th Specialty Films & Flexible Packaging Conference

Building On a Database of More Than 20,000 Results: HAVER&BOECKER Reveals the Value of The FT4 Powder Rheometer For Developing High Performance Packaging Solutions.

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