In an article recently published in the open-access journal Light: Science & Applications, researchers constructed a specific GeSn-on-insulator (GeSnOI) stack with the help of stressor layers as dielectric optical claddings. They also demonstrated that GeSnOI is suitable for monolithic integration of planar Group-IV semiconductor lasers on photonic platforms in the near- and mid-infrared wavelength range.
The latest research in the Journal of Materials Research and Technology is focused on the evaluation of microstructural properties and toughness of industrial electric resistance welding (ERW) equipment.
Researchers have devised a data-centric approach to generative modelling for 3D-printed steel. The team believe that their model could help determine the quality of a design and the material before fabrication.
Beryllium copper was widely considered a versatile material for applications ranging from electronics and computer components to aircraft brake systems and telecommunication equipment.
FABTECH, North America’s largest metal forming, fabricating, welding and finishing event, will return to Chicago Sept.13-16, providing attendees with a long-awaited opportunity to see the latest trends and products in person.
Leading materials supplier, Goodfellow, has announced the launch of a worldwide exclusive range of ultrafine wires, including microwires of Copper, Nickel, Platinum and more.
Hitachi High-Tech Analytical Science has further expanded its metals analysis range with the launch of the OE720
SHENMAO America, Inc. has introduced its PF719-P250 thermal fatigue resistant solder alloy for automobile electronics. With a wide process window and a variety of unique features, this solder paste is ideal for even the most complicated printed circuit board (PCB) design.
NanoAL, LLC announced today that it has signed a Commercial License Agreement with Mitsubishi Corporation RtM Japan Ltd. (RtMJ) to bring its award-winning Addalloy® family of advanced aluminum alloy powders to the rapidly growing Metal Additive Manufacturing (AM) Market in Asia.
DeepGreen Metals, which is exploring for deep-ocean polymetallic nodules as a lower impact and more cost-effective alternative to terrestrial mining, today announced an upward revision to the nodule resource reported wit...