When developing new technologies, engineers do their best to keep it simple. Adding layers of complication can lead to more things that could potentially go wrong.
A team of researchers led by the U.S. Department of Energy's Lawrence Berkeley National Laboratory (Berkeley Lab) developed a powerful new approach that enabled them to directly observe how electrons interact with defects in advanced semiconductor devices with an unprecedented level of detail.
The name of Ethan Secor’s startup company – “Contour Circuits” – is a great description of the technology he and his research group are developing.
ZEISS today introduced ZEISS VersaXRM 5 Insight, a hybrid 3D X-ray microscope designed to help researchers and engineers understand samples faster. Combining X-ray microscopy and microCT in a single platform, the system delivers multi-scale imaging, guided workflows, and automated AI-enabled reconstruction for efficient non-destructive 3D imaging.
Researchers developed a room-temperature, maskless electrodeposition method for directly 3D-printing freestanding copper microinductors onto chip contact pads, enabling inductance to be generated without requiring additional dedicated planar silicon area. The printed microsolenoids achieved nanohenry-range inductance, quality factors up to 18, and experimentally validated inductive behavior up to 15 GHz, supporting their potential for post-fabrication integration into future RF electronics.
A signal that appears to show ions moving inside a battery may, in fact, be an illusion caused by an uneven surface. A KAIST research team has identified the origin of this type of artifacts, which can lead researchers to misinterpret what is happening inside a battery, and has developed a method to reduce it. The findings are expected to enable more accurate analysis of ion movement and improve the reliability of next-generation battery-material development, including that of solid-state and sodium-ion batteries.
Bruker today announced the launch of the XFlash® 7200 FIRE, the world’s first inclined large-area Energy-Dispersive Spectroscopy (EDS) detector for Scanning Electron Microscopy (SEM) built on Bruker’s revolutionary four-segment Silicon Drift Detector (SDD) architecture.
Bruker today announced the launch of two groundbreaking detectors at Microscopy & Microanalysis (M&M) 2026: the eWARP™ TKD, a next-generation Transmission Kikuchi Diffraction (TKD) detector for nanoscale crystallographic characterization, and the XFlash® FlatQUAD™ 2L, the latest evolution of Bruker’s annular EDS detector, enabling simultaneous Energy Dispersive X-ray Spectroscopy (EDS) and Back-Scattered Electron (BSE) detection.
Researchers developed a liquid metal-semiconductor valve that regulates current direction while remaining functional in flexible circuits stretched to approximately 1000% strain. The system also supports tunable switching, reconfigurable OR and AND logic, and wireless-energy-assisted logic operation under extreme deformation, providing a new approach to adaptive soft electronics.
Researchers used atomic-resolution imaging and simulations to show how twist angle alters halide-ion migration across CsPbBr3–CsPbCl3 perovskite heterostructures by changing the formation of interfacial diffusion channels. A 28° twist delayed interdiffusion, reduced the diffusion-channel ratio by more than 60%, and improved photodetector stability under accelerated thermal testing.
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