ACM Research, Inc. (ACM), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that it has expanded its 300mm Ultra Fn furnace dry processing platform with the introduction of its Ultra Fn A furnace tool.
Organic semiconductors (OSs) used in organic solar cells show promise as a candidate for facilitating clean hydrogen production from sunlight. However, they suffer from slow charge transfer and chemical instability.
The drawback of the conventional von Neumann computing method’s high-power consumption has been overcome by the development of neuromorphic computing systems, which imitate the human brain.
EV Group (EVG) introduced NanoCleave™ today, a revolutionary layer release technology for silicon that enables ultra-thin layer stacking for front-end processing.
A household microwave oven modified by a Cornell engineering professor is helping to cook up the next generation of cellphones, computers and other electronics after the invention was shown to overcome a major challenge faced by the semiconductor industry.
Lead halide perovskites (such as MAPbI3), a new class of semiconductor materials, have exceptional optoelectronic properties that make them suitable for photovoltaic and light-emitting applications.
The way that leaves transport solar energy over relatively long distances before using it to power chemical reactions can be mimicked by a comparatively new type of semiconductor that is stacked on top of a mirror-like structure. The method might one day increase the effectiveness of solar cells.
MIT engineers reveal a novel discovery in semiconductors, well-known materials that have been the subject of intensive study for over 100 years due to their numerous applications in electronic devices.
Scientists from the Department of Chemistry at Bilkent University in Ankara, Turkey, have analyzed lithium batteries using non-linear harmonic analysis and EIS. By comparing experimental measurements and mathematical simulations, the authors have identified harmonic distortions and other critical factors in these devices. Their work has appeared in Electrochimica Acta.
Bipartisan congressional approval of the CHIPS and Science Act, signed into law Tuesday by President Joe Biden, will drive a $52 billion investment by the federal government to help expand and accelerate U.S. semiconductor manufacturing, an important step for an industry critical to both economic competitiveness and national security.