Cabot Supermetals, a business unit of Cabot Corporation, has announced the official opening of its new Thin Films manufacturing facility located in Etna, OH. The new 90,000 sq. ft. state-of- the-art facility produces tantalum sputtering targets for use in semiconductor, optics, magnetics and flat panel display applications. Cabot invested approximately $12 million to build the site that currently employs 20 people.
Kennett F. Burnes, Chairman and CEO, Cabot said, "This investment demonstrates our commitment to meeting the needs of our customers. As a leader in the production of tantalum, Cabot's new Thin Films facility assures a source of high-quality materials for our customers worldwide."
Thin films of tantalum metal enable the use of copper metal interconnections between transistors in electronic devices. Cabot's new sputtering target manufacturing facility is a hands-free, "lights out" environment that combines robotic material handling, dynamic scheduling and automated process control. This advanced system enables Cabot to produce a high volume of consistent targets on time and at lower costs. In addition to these innovations, construction of the new facility included the installation of daylighting panels filled with Cabot's Nanogel(R) translucent aerogel material.
The new Etna location manufactures complete target assemblies for use in thin film deposition systems. Processes in the Etna facility include metal joining, shaping, machining and surface finishing steps designed to prepare the materials for use in ultra-clean environments at leading semiconductor and other technology manufacturers around the world.