Dow Corning Exhibits Release Coating Solutions at Label Summit Latin America

Dow Corning announced that it has showcased several release coating solutions at Label Summit Latin America 2011, a two-day symposium and exhibition that was scheduled on May 17 to 18, 2011 in São Paulo, Brazil.

Pressure Sensitive Industry group of Dow Corning exhibited a new solvent-free release coating solution, which is a part of its Syl-Off Advantage Series. In addition, the company displayed advanced anti-misting release coating systems, Syl-Off Advantage line of release coatings and thermal-cure release coatings for film substrates.

Dow Corning delivers a wide range of crosslinkers, release coatings and silicon-based adhesives. The company works consistently to develop cost-effective, sustainable and high-performance technologies to serve customers in local region and worldwide.

Label Summit Latin America was attended by label industry’s top associations, suppliers and converters mainly from the U.S., Europe and Latin America. Industry leaders discussed about smart and interactive labels, flexible packaging, digital printing, environmental sustainability and brand protection.

Source: http://www.dowcorning.com/

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