Picosun Oy, the leading supplier of high quality Atomic Layer Deposition (ALD) equipment and solutions for global industries, reports continuous success for its plasma ALD technology.
Picosun’s patented PICOPLASMA™ source system is now available on cluster integrated,
SEMI S2 certified PICOSUN™ P-series production ALD modules. The remote, inductively
coupled plasma with highly reactive radicals extends the selection of ALD processes and
allows damage-free coating of sensitive substrates such as plastics, polymers, or metal
foils. A prime example of this is the first low temperature ALD graphene deposition in a
PICOSUN™ plasma ALD tool.
The PICOPLASMA™ source system is also ideal for deposition of conductive materials such
as pure metals or nitrides without risk of short-circuiting or particle formation. Its
optimized design enables constant breakthroughs in ALD metal processes, such as the
recently reported full wafer gold deposition using Picosun’s plasma ALD technology.
“Plasma-assisted ALD processes, such as high quality noble metal or nitride layers, are
becoming essential in the manufacturing of various microelectronic components.
Especially in compound semiconductor device and MEMS manufacturing low processing
temperatures, enabled by plasma ALD, are often crucial. The non-destructive, radicalbased
processing with our PICOPLASMA™ systems is enabling the future technology
nodes for global semiconductor industries,” summarizes Juhana Kostamo, Managing
Director of Picosun.