Indium Corporation will feature its new high-performance, high-reliability low-temperature alloy technology at Productronica, November 12-15, Munich, Germany.
DurafuseTM LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications that need to reflow below 210 °C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, DurafuseTM LT provides improved drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup. DurafuseTM LT:
- Provides a solution for heat-sensitive components and flex polymers
- Prevents thermal warpage of processor components and multilayer boards
- Meets low-temperature requirements for step soldering, particularly in RF shield attachment and rework applications
Source: https://www.indium.com/