Indium Corporation will feature its fine-grade precision die-attach AuSn ribbon at NEPCON Japan, January 15-17 in Tokyo, Japan.
AuLTRATM-FINE die-attach AuSn ribbon is designed for high-volume, fully-automated laser diode assembly. Indium Corporation’s precision, high-volume production lines can produce AuLTRATM-FINE ribbons as small as 0.254mm (0.010”) wide by 0.0152mm (0.0006”) thick.
The ribbon delivers excellent edge quality with no warping or bends, and is packed on high-quality spools designed specifically for automated laser diode assembly. Indium Corporation is capable of producting spools >15 meters of continuous length.
For more information about Indium Corporation’s precision gold products, see our experts at the show at booth #ISP2-0407 or visit www.indium.com/gold.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.