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Sub-One Technology – Smooth, Hard Coatings for Internal Surfaces and Cavities

Sub-One has developed a patented process as well as state-of-the-art systems for depositing its advanced coatings onto the internal surfaces of a broad spectrum of products. Pipe coating and combating pipeline corrosion are, in fact, among the largest applications for this technology.

From Sub-One Technology - Pipe and Tube Coatings 25 Sep 2007

Pattern Recognition System for Flaw Identification in Semiconductor Wafers from NextTechs Technologies

This technology has been developed to inspect semiconductor wafers and identify flaws and features on a nano-technology scale. However, the sensors, algorithms, neural network systems, optics and camera technologies are available for use in a wide variety of applications.

25 Sep 2007

Interferometric Moduator for Optical Signal Processing from NextTechs Technologies

An interferometer modulator uses a beamsplitter to produce deflected and transmitted light beams onto mirrored surfaces of a piezoelectric crystal pair.

25 Sep 2007

Tinius Olsen – Materials Testing Machines and Equipment

Tinius Olsen offers a range of machines for testing tension, compression, impact, and more on various materials, adhering to international standards.

From Tinius Olsen 14 Sep 2007

Tensile Stress Stage for Microscopes Allows Real Time Observation of Materials

Linkam are pleased to announce the latest addition to their range of material characterization systems – the TST350 tensile stress stage for the visualisation and measurement of physical properties of samples. Posted March 2007

6 Sep 2007

ISS Group Offer Thermo Scientific Microanalysis Solution - News Item

The ISS Group are pleased to announce the UK availability of the latest microanalysis technology from Thermo Scientific: the NORAN System SIX, the simplest instrument on the market to get microscopists to their final answer in the shortest possible time. Posted July 2007

From ISS Group Services Ltd 5 Sep 2007

MRS International Materials Research Conference

The Materials Research Society (MRS) and Chinese Materials Research Society (C-MRS) announce a new joint international conference and exhibit—MRS International Materials Research Conference. This is the premier event for leading researchers around to meet in China to share ideas. Posted August 2007

24 Aug 2007

Materials Research Society - MRS 2008 Spring Meeting

The 2008 MRS Spring Meeting will feature 41 technical symposia in five topical clusters, an international exhibit highlighting products and services of interest to the materials community, and much more. Posted August 2007

24 Aug 2007

Particle Size and Shape Analysis of Abrasive Grains

It is the hardness and sharp particle shape of abrasives that makes them effective.

From Malvern Panalytical 17 Aug 2007

Rheology of Thermoplastic Melts-Determination of Rheological Properties Using Rotational and Capillary Rheometers

Polymers are complicated materials to characterize rheologically because there are many factors that influence their flow properties.

From Malvern Panalytical 16 Aug 2007

Editorial Highlights

The Current State of the Global Semiconductor Market

The global semiconductor market has entered an exciting period. Demand for chip technology is both driving the industry as well as hindering it, with current chip shortages predicted to last for some time. Current trends will likely shape the future of the industry, which is set to continue to show

How are Graphene Batteries Made?

The primary distinction between graphene-based batteries and solid-state batteries lies in the composition of either electrode. Although the cathode is commonly changed, carbon allotropes can also be employed in fabricating anodes.

What Role Will The IoT Play In The Electric Vehicle Industry?

In recent years, the IoT is rapidly being introduced into almost all sectors, but it has particular importance in the EV industry.

Latest Articles

Sub-One Technology – Smooth, Hard Coatings for Internal Surfaces and Cavities

Pattern Recognition System for Flaw Identification in Semiconductor Wafers from NextTechs Technologies

Interferometric Moduator for Optical Signal Processing from NextTechs Technologies

Tinius Olsen – Materials Testing Machines and Equipment

Tensile Stress Stage for Microscopes Allows Real Time Observation of Materials

ISS Group Offer Thermo Scientific Microanalysis Solution - News Item

MRS International Materials Research Conference

Materials Research Society - MRS 2008 Spring Meeting

Particle Size and Shape Analysis of Abrasive Grains

Rheology of Thermoplastic Melts-Determination of Rheological Properties Using Rotational and Capillary Rheometers

Innovating Analytical Science: Precision in Focus with QSight®

An Introduction to Reverse Tip Sample Scanning Probe Microscopy (RTS SPM)

Advancing Solid-State Battery Research

RXT Series: Reliance® Legacy Motors

msFineAnalysis: Automatic Qualitative Analysis Software

Enhance Nanostructure Analysis With the SAXSpoint 500 SAXS/WAXS System

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The Role of Vibration Isolation in Improving NMR Accuracy

An Introduction to OMNISEC RESOLVE Multi-Detector GPC/SEC System

How Photothermal AFM-IR Reveals Hidden Details in Polymer Blends

Using SDT to Analyze the Thermal Properties of LFP Li-Ion Cathodes

Editorial Highlights

The Current State of the Global Semiconductor Market

How are Graphene Batteries Made?

What Role Will The IoT Play In The Electric Vehicle Industry?

Latest Articles

Innovating Analytical Science: Precision in Focus with QSight®

An Introduction to Reverse Tip Sample Scanning Probe Microscopy (RTS SPM)

Advancing Solid-State Battery Research

1Triple-Layer Material Boosts Green Hydrogen Production Eightfold

2Exum Instruments and Thermo Fisher Scientific Enter into Commercial Agreement for Scientific Advancement in Europe and China

3Emerson's New Battery Energy and Asset Management Software Improves Return on Investment, Grid Stability

4Nuvvon Reports a Major Breakthrough in Solid-State Battery Scalability

5Scientists Design Novel Absorber for High-Performance Tandem Solar Cells

6Breakthrough in 3D Chip Integration Promises Faster, More Efficient High-Performance Computing

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Editorial Highlights