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GaN RF Chip Manufacturer, TriQuint, Achieves Manufacturing Readiness Level 9

TriQuint Semiconductor, Inc., a leading RF solutions supplier and technology innovator, announced that it is the first gallium nitride (GaN) RF chip manufacturer to achieve Manufacturing Readiness Level (MRL) 9.

From Qorvo technology 30 Jul 2014

New Line of Press Brake Tooling Punches and Dies from Mate Precision Tooling

Mate Precision Tooling, a world-leading manufacturer of high-quality tooling for the metal fabrication market, has launched a new line of press brake tooling punches and dies.

From Mate Precision Tooling 30 Jul 2014

ESI’s Virtual Reality Solutions Implemented at AEROCAMPUS Aquitaine

ESI Group, pioneer and world-leading solution provider in Virtual Prototyping for manufacturing industries, announces the implementation of ESI's Virtual Reality solutions at AEROCAMPUS Aquitaine.

30 Jul 2014

USPTO Grants eSurface Multiple Patents for Process to Manufacture PCBs with Ultra-Fine Capabilities

eSurface® Technologies, the developer of the eSurface proprietary process for printed circuit boards, today announced it has been granted two patents by the United States Patent and Trademark Office.

30 Jul 2014

Edwards Installs Modular Steel Degassing System for Large Italian Steel Producer

Edwards has installed a modular steel degassing system in a large steel producer in Italy, replacing an existing steam ejector system which had high running costs and energy usage.

30 Jul 2014

New Report on Global Advanced Functional Materials Market

Reportlinker.com announces that a new market research report is available in its catalogue: Global Advanced Functional Materials Market 2014-2018

30 Jul 2014

$Minteq to Provide Total Refractory Maintenance for Bhushan Steel’s BOF Facility at Angul$

Minteq to Provide Total Refractory Maintenance for Bhushan Steel’s BOF Facility at Angul

Minerals Technologies Inc. announced today that its Refractories business unit, Minteq International Inc., has signed an agreement with Bhushan Steel Ltd. of India, to provide cost-per-ton (CPT) steel refractory maintenance for two of Bhushan's Basic Oxygen Furnaces (BOF) at its new steel-making facility in Angul in the state of Orissa. This is the first CPT contract Minteq has signed in India.

From Minerals Technologies Inc. 30 Jul 2014

Dow Corning’s TPSiV Elastomers Proven Safe for Skin Contact Applications

Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced today that its TPSiV® 4000 and TPSiV® 4200 Thermoplastic Elastomers (TPEs) have been shown to be safe for skin contact applications in two independent medical test protocols.

From Dow Corning 30 Jul 2014

NIWeek 2014: Averna to Showcase Compact Solution for Automated Functional Product Testing

Averna will be exhibiting at NIWeek 2014, the industry's premier event on graphical system design, and participate in the opening keynote address. NIWeek 2014 begins August 4 at the Austin Convention Center in Austin, Texas, for three days of interactive technical sessions, case study presentations, and panel discussions on the latest advances in design, control, automation, manufacturing, and test.

30 Jul 2014

IDT Magazine Selects Stratasys Objet30 OrthoDesk 3D Printer as Top-10 Technology Product

Stratasys Ltd., a leading global provider of 3D printing and additive manufacturing solutions, today announced the Objet30 OrthoDesk 3D Printer was selected as the top-10 technology product for 2014 by the readers of Inside Dental Technology (IDT) magazine.

From Stratasys Ltd. 30 Jul 2014

Global Semiconductor Wafer Cleaning Systems Market Forecast to Grow at 16% CAGR

Research and Markets has announced the addition of the "Global Semiconductor Wafer Cleaning Systems Market 2014-2018" report to their offering.

From Research and Markets 30 Jul 2014

TriMas Adds Lion Holdings to Portfolio of Packaging Companies

TriMas Corporation – a diversified global manufacturer of engineered and applied products – today announced that it has acquired Lion Holdings Pvt. Ltd. for $27 million, paid in cash at closing. The transaction closed July 25, 2014, at which time Lion Holdings became part of the Company's Packaging segment.

30 Jul 2014