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PCD&F Magazine Honors Dow with NPI Award for MICROFILL LVF-3 Acid Copper

For the sixth time, Dow Electronic Materials, a business unit of The Dow Chemical Company, has received the New Product Introduction (NPI) Award from Printed Circuit Design and Fab (PCD&F) Magazine with its MICROFILL™ LVF-3 Acid Copper.

From Dow Electronics 13 May 2014

Industrial Packaging Company, Mauser Group, to be Acquired by Clayton, Dubilier & Rice

Clayton, Dubilier & Rice today announced an agreement under which CD&R-managed funds will acquire Mauser Group, one of the world's leading industrial packaging companies. The transaction is valued at approximately €1.2 billion. Additional terms were not disclosed.

13 May 2014

Global Insight Report on 3D Printing Market

Research and Markets has announced the addition of the "3D Printing Market (Material, Technology, Application): Global Insight (2014-2022)" report to their offering.

From Research and Markets 13 May 2014

Sherwin-Williams Enters JV to Launch Premier Paints Company in Saudi Arabia

Sherwin-Williams has expanded its services in the Middle East after establishing a new business in Saudi Arabia.

From The Sherwin-Williams Company 13 May 2014

Master Bond Introduces Two Component, Thermally Conductive Epoxy which Resists High Temperatures

Formulated for bonding and sealing applications, Master Bond EP46HT-1AO is widely used in the aerospace, electronic and specialty OEM industries. Unlike most conventional two component epoxies, EP46HT-1AO cures with t...

From Master Bond Inc. 12 May 2014

Water Based Converting Solutions, Two Presentations by Michelman at TAPPI PLACE 2014 Conference

CINCINNATI, OH (May 12, 2014) - Michelman will do two presentations at the TAPPI PLACE 2014 Conference being held May 13-15, 2014 in Ponte Vedra, Florida, USA. The first presentation is entitled “Advances in Aqu...

12 May 2014

PI Ceramic GmbH Launch New Website

Clean layout and improved access and navigation: The new website of PI Ceramic GmbH has a modern design with updated contents and extended services. The clear structure of the website facilitates an intuitive orientat...

From PI Ceramic GmbH 12 May 2014

Conducting Polymer Arrays Allow Manipulation of Cells

The ability to create conducting polymer films in a variety of shapes, thicknesses and surface properties rapidly and inexpensively will make growing and testing cells easier and more flexible, according to a team of Penn State bioengineers.

12 May 2014

Axalta’s Abcite 1060 Powder Coating System Receives ISO 20340 Certification

The Abcite® 1060 powder coating system from Axalta Coating Systems has passed the strict requirements of ISO 20340 for single layer protective paints for applications offshore and related structures. In addition, the coating system offers flexible and primer-free application, requires virtually no maintenance and is durable.

12 May 2014

FIRJAN and ITW Collaborate to Conduct Research on Welding

Sistema FIRJAN (the FIRJAN System - Federation of Industries of the State of Rio de Janeiro, or Federacao das Industrias do Estado do Rio de Janeiro) and the company ITW, whose portfolio includes brands such as Miller El...

12 May 2014

New Report on Connected Living Room Market

According to a new market research report "Connected Living Room Market by Products (Smart/3D, LED/LCD/OLED TV, set top box, Home theater (Projector, Audio Equipment), Blu-ray player, Gaming console), Technology (Processor, Memory, Sensor, Connectivity) & Geography - Global Trend & Forecast to 2013 - 2020", published by MarketsandMarkets, the total Connected Living Room Market is expected to cross $957.65 Billion by 2020, at a CAGR of 6.8% rate from 2014 to 2020.

12 May 2014

PCIM Europe 2014: EPC to Highlight eGaN FETs in 10 MHz Buck Converters

Efficient Power Conversion Corporation, the world’s leader in enhancement-mode gallium nitride on silicon (eGaN®) power FETs will be presenting three application-focused technical presentations at PCIM Europe. The conference will be held in Nuremberg, Germany from May 20th through the 22nd.

12 May 2014

Samsung Begins Production at New NAND Flash Memory Chips Manufacturing Facility in Xi’an, China

Samsung Electronics, Co., Ltd., a global leader in memory semiconductor technology, today announced that its memory fabrication line in Xi’an China has begun full-scale manufacturing operations. The new facility will manufacture Samsung’s advanced NAND flash memory chips: 3D V-NAND.

From Samsung Electronics Co., Ltd. 12 May 2014

OSA Commends 19 Winners of NIST Advanced Manufacturing Technology Consortia Program

The Optical Society (OSA) today congratulated the 19 grant winners of the U.S. National Institute of Standards and Technology’s (NIST) Advanced Manufacturing Technology Consortia (AMTech) Program.

12 May 2014

New 150 V N-Channel MOSFET in Thermally Enhanced PowerPAK SC-70 Package from Vishay

Vishay Intertechnology, Inc. today introduced the industry's first 150 V n-channel MOSFET in the compact, thermally enhanced PowerPAK® SC-70 package. Offering the industry's lowest on-resistance at 10 V in the 2 mm by 2 mm footprint area, the Vishay Siliconix SiA446DJ is designed to increase efficiency by reducing conduction and switching losses in a wide range of space-constrained applications.

12 May 2014