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Xilinx Offers High Performance DDR4 Memory Solution for All Programmable UltraScale Devices

Xilinx, Inc. today announced availability of the industry's first high performance DDR4 memory solution for All Programmable UltraScale™ devices running at 2400 Mb/s. Based on an ASIC-class architecture, the UltraScale devices support massive I/O and memory bandwidth with dramatic power and latency reduction.

11 Mar 2014

METAV: CimatronE to Display High Speed Roughing

Cimatron Limited announced today that its acclaimed integrated CAD/CAM software, CimatronE, will display high speed roughing at the METAV trade show, March 11-15, 2014, in Dusseldorf, Germany.

11 Mar 2014

Camtek Commences Evaluation of Next Generation Semiconductor Inspection and Metrology Platform

Camtek Ltd., today announced that it is starting the customer evaluation of its next generation Semiconductor Inspection and Metrology platform. This a major milestone event, rejuvenating Camtek's semiconductor product line with the latest cutting-edge inspection technologies, designed for the Advanced Packaging market.

11 Mar 2014

Key 3M Patent for Lithium Ion Battery NMC Cathode Technology Emerges from Reexamination

A key 3M patent for lithium ion battery nickel-manganese-cobalt (NMC) cathode technology has emerged from reexamination at the U.S. Patent and Trademark Office (USPTO) with all original claims being confirmed as patentable and with no amendments (U.S. Patent 7,078,128). NMC cathode technology is widely used in lithium ion batteries for consumer electronics and electric vehicles.

From 3M 11 Mar 2014

JEC Europe: ThyssenKrupp to Display Capabilities in CFRP Components

ThyssenKrupp is to take part in the world’s biggest composites show. The company will be displaying its capabilities in carbon fiber reinforced plastics (CFRP) at booth M35 in hall 7.2 at the JEC Europe show in Paris from March 11 to 13.

11 Mar 2014

New Report on World Medical Device Packaging Market

Reportbuyer.com just published a new market research report: World Medical Device Packaging Market

11 Mar 2014

CeBIT 2014: Airwolf 3D to Highlight 3D Printers

Airwolf 3D, a designer and manufacturer of high-performance 3D printers, together with SET Ltd., a leading German solutions provider, will be showcasing Airwolf 3D’s American-made product line at CeBIT 2014 here this week from March 10-14, 2014 in Hall 3, Booth H01/1.

11 Mar 2014

Liqui-Box Fountain Beverage Bag and Connector System Receives Technical Innovation Award

Liqui-Box®, a world leader in flexible packaging solutions is proud to announce they are the recipient of an award related to their capabilities to design, develop and produce innovative flexible packaging technology. The Silver Award for Technical Innovation was presented to Liqui-Box® for their development and production of the Ecoflex99™ Fountain Beverage Bag and Connector System.

11 Mar 2014

Rapid Infrastructure Development Contributes to Growth of Global Nondestructive Testing Equipment Market

Research and Markets has announced the addition of the "Global Nondestructive Testing Equipment Market 2012-2016" report to their offering.

From Research and Markets 11 Mar 2014

Master Bond LED Curable System Passes Plastics Test for USP Class VI and ISO 10993-5 Cytotoxicity Requirements

Widely used in the manufacture of disposable medical devices, Master Bond LED403Med is a single component system that passes the plastics test for USP Class VI and ISO 10993-5 cytotoxicity requirements. This medical grade system withstands sterilization methods such as gamma radiation, EtO and various chemical sterilants.

From Master Bond Inc. 11 Mar 2014

Zero-Maintenance Fiber Reinforced Polymer Trail Bridge Installed at Germantown MetroPark

Dayton, Ohio’s Five Rivers MetroParks has installed a prefabricated, 20-footFiberSPAN™ trail bridge in Germantown MetroPark. Manufactured by Composite Advantage, the zero-maintenance Fiber Reinforced Polymer (FRP) trail bridgespans a stream as part of a new trail construction project at the Germantown, Ohio park.

From Creative Composites Group 11 Mar 2014

Dow Introduces VORAFORCE TW 1100 Series Polyurethane Systems for Composites Fabrication

Dow expands its composites portfolio with the VORAFORCETM TW 1100 series of polyurethane systems developed for composites fabrication by filament winding, to enhance the existing epoxy systems offering.

From Dow Chemicals 11 Mar 2014

Ambrell Provides Induction Heating Equipment to Aerospace Manufacturers

Ambrell, a leading manufacturer of induction heating systems, is a key provider to aerospace manufacturers and their suppliers. Induction’s fast, repeatable, controllable, non-contact heating which requires a minimal footprint makes it an ideal solution for the industry.

From Ambrell Induction Heating Solutions 10 Mar 2014

SENTECH Instruments Advanced ICP Etching System Used at Fraunhofer IISB

SENTECH Instruments has developed the advanced PTSA (planar triple spiral antenna) inductively coupled plasma source which provides the core plasma technology used in the ICP plasma etcher for low damage and high rate etching, and which is used in the ICPECVD low temperature deposition systems.

From Sentech Instruments 10 Mar 2014

PI's H-820 Hexapod Stage Passes Million-Cycle Endurance Test Specification

The H-820 Hexapod from PI (Physik Instrumente) reaches all specifications after the endurance test, with a million cycles at 20 mm/s with a 20kg load.

From PI (Physik Instrumente) LP 10 Mar 2014