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New Ultra-Thin Wafer Dicing Solution Released by ESI

New Ultra-Thin Wafer Dicing Solution Released by ESI

TITANIUM 2010 Conference to be Held from Oct 3 to 6 in Florida

China Ruitai Completes Installation of New Ethyl Cellulose Production Line

Historical Data and Analysis on Brazil’s Concreting Equipment Industry

EH+E to Review Methods for Removing Polychlorinated Biphenyls from Buildings

Iodine Demand Increases in Manufacturing Optical Polarising Films

Applied Materials to Service Production Equipment at NXP’s Facility

Applied Materials to Service Production Equipment at NXP’s Facility

BSA and BioSET Awarded Technology Patent to Develop Synthetic Peptides

BSA and BioSET Awarded Technology Patent to Develop Synthetic Peptides

New Process Developed to Grind Cementitious Materials

Guide Available on $16.6 Billion U.S. Paint Industry

Global Market for  Piezoelectric Actuators and Motors Expected to be Worth $12.3 Billion by 2014

Global Market for Piezoelectric Actuators and Motors Expected to be Worth $12.3 Billion by 2014

Bemis Completes Sales of Discontinued Packaging Operation

Bayer Sign Research Agreement for High Performance Materials with Customizable Properties

Imec Set Record for Large Area Thin-Film Silicon Solar Cells

Micron Technology, Applied Materials and Ultratech Welcome Partners to GaN Research Program

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