Materials Science News

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Germanium in Place of Silicon would Allow Faster Chips with Smaller Transistors

Germanium in Place of Silicon would Allow Faster Chips with Smaller Transistors

Sugar-Based Polymer Packaging Material that can be Composted

New Undertsanding of Catalysts

Composite Metal Foam Could Make Biomedical Implants More Compatible

Composite Metal Foam Could Make Biomedical Implants More Compatible

IBM Award Prize to Solar Reseachers

IBM Award Prize to Solar Reseachers

Kobe Steel Opens Large Capacity Compressor Test Facility

Bayer MaterialScience Showcase Conductive Nano Inks at Nanotech

Society of Plastics Engineers Announces Finalists for Clean Technology Competition

Society of Plastics Engineers Announces Finalists for Clean Technology Competition

Semiconductor Sales Expected to Slow Throughout 2010

Semiconductor Sales Expected to Slow Throughout 2010

3rd Plasma Etch and Strip in Microelectronics Workshop to be Held in Grenoble

Kyocera Solar Forms Strategic Partnership

CRAIC Introduces Flagship UV-Visible-NIR Microspectrophotometer

CRAIC Introduces Flagship UV-Visible-NIR Microspectrophotometer

SCHOTT's New Tempering Furnace Featuring Fused Silica Tempering Rollers Exceeds Standards

SCHOTT's New Tempering Furnace Featuring Fused Silica Tempering Rollers Exceeds Standards

Industry and Science Collaborate to Build the European Spallation Source

Oxford Instruments Announces Impoved End Point Capability for Plasma Etch and Deposition Tools

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