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Kobe Steel Opens Large Capacity Compressor Test Facility

Bayer MaterialScience Showcase Conductive Nano Inks at Nanotech

Society of Plastics Engineers Announces Finalists for Clean Technology Competition

Society of Plastics Engineers Announces Finalists for Clean Technology Competition

Semiconductor Sales Expected to Slow Throughout 2010

Semiconductor Sales Expected to Slow Throughout 2010

3rd Plasma Etch and Strip in Microelectronics Workshop to be Held in Grenoble

Kyocera Solar Forms Strategic Partnership

CRAIC Introduces Flagship UV-Visible-NIR Microspectrophotometer

CRAIC Introduces Flagship UV-Visible-NIR Microspectrophotometer

SCHOTT's New Tempering Furnace Featuring Fused Silica Tempering Rollers Exceeds Standards

SCHOTT's New Tempering Furnace Featuring Fused Silica Tempering Rollers Exceeds Standards

Industry and Science Collaborate to Build the European Spallation Source

Oxford Instruments Announces Impoved End Point Capability for Plasma Etch and Deposition Tools

Voxtel Releases New Range of Backside Illuminated APDs

Voxtel Releases New Range of Backside Illuminated APDs

Arkema to Present Two New Nano Products at Nano Tech in Japan

Simple Process for Producing Doped Graphene for Future Electronic Devices

Simple Process for Producing Doped Graphene for Future Electronic Devices

DOE Commission TMS to Lead Project on New Materials for Energy Efficiency and reduced Carbon Emissions

RPC Containers Suitable for Chicken Poo

RPC Containers Suitable for Chicken Poo

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