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Researchers Develop Smallest 3D Transistor to Enable Higher-Performance Electronics

A 3D transistor measuring less than half the size of present-day’s smallest commercial models has been fabricated by scientists from MIT and the University of Colorado. To accomplish that, they formulated a unique microfabrication method that alters semiconductor material atom by atom.

10 Dec 2018

Novel Concept Based on Fluoride Ions May Boost Battery Lifetime

Imagine if it were possible to go for weeks without charging your laptop or phone. That is the dream of scientists looking into substitute batteries that surpass the popular present-day lithium-ion versions.

7 Dec 2018

Novel Diffusion-Drift Model for Evaluating Impact of Ionizing Radiation on Microelectronic Devices

Achieving a reduction of the size of the active regions of diode and transistor structures is the main trend in the development of hardware components for digital and analog electronic equipment.

7 Dec 2018

For the First Time in History, Virus Used to Speed Up Modern Computers

In a pioneering research, scientists have successfully formulated a method that could lead to extraordinary advances in computer speed and efficiency.

6 Dec 2018

Stretchable, Ultrathin Electronic Skin Holds Potential in Human-Machine Interactions

Sensitive nerve cells present in the human skin have the ability to detect a variety of sensations including temperature and pressure that enable tactile interactions with the environment.

29 Nov 2018

Brochure on Precision Motion Control & Positioning Systems for Electronics Manufacturing

With decades of semiconductor expertise, PI's brochure presents motion systems that adapt to industry demands, enhancing efficiency in manufacturing processes.

From PI (Physik Instrumente) LP 28 Nov 2018

Digicom Electronics Upgrades Medical Device Quality Certification to ISO 13485:2016

Digicom Electronics upgrades to ISO 13485:2016, enhancing quality in medical device manufacturing with advanced processes and stringent cleanliness standards.

From Digicom Electronics 27 Nov 2018

Digicom Electronics Upgrades Medical Device Quality Certification to ISO 13485:2016

Digicom Electronics, Inc., a technology and quality driven electronics manufacturing services company, announces that it has upgraded its Medical Quality Device Certification to ISO 13485:2016. The ISO 13485 standard is a series of requirements that help device makers develop a quality management system to ensure the quality, safety, and effectiveness of the medical devices they manufacture. Digicom specializes in complex products and those that require the utmost precision, reliability, durability, and enhanced performance.

From Digicom Electronics 27 Nov 2018

NASA Low Outgassing Rated UV Curing Adhesive with High Glass Transition Temperature

EP17HTND-CCM is a single-component epoxy with excellent thermal conductivity and chemical resistance, perfect for high-temperature electronic applications.

From Master Bond Inc. 27 Nov 2018

Novel Anisotropic Conductive Film Could Address Electrical Short Problems in Ultra-Fine Pitch Assembly Process

Ultra-fine pitch assemblies are increasingly required by higher resolution display electronic devices. In this context, display driver interconnection technology has turned out to be an important challenge for advancing display electronics.

14 Nov 2018

Editorial Highlights

Electronics News

Researchers Develop Smallest 3D Transistor to Enable Higher-Performance Electronics

Novel Concept Based on Fluoride Ions May Boost Battery Lifetime

Novel Diffusion-Drift Model for Evaluating Impact of Ionizing Radiation on Microelectronic Devices

For the First Time in History, Virus Used to Speed Up Modern Computers

Stretchable, Ultrathin Electronic Skin Holds Potential in Human-Machine Interactions

Brochure on Precision Motion Control & Positioning Systems for Electronics Manufacturing

Digicom Electronics Upgrades Medical Device Quality Certification to ISO 13485:2016

Digicom Electronics Upgrades Medical Device Quality Certification to ISO 13485:2016

NASA Low Outgassing Rated UV Curing Adhesive with High Glass Transition Temperature

Novel Anisotropic Conductive Film Could Address Electrical Short Problems in Ultra-Fine Pitch Assembly Process

Polymer Characterization: From Lab to Production

How Battery Material Synthesis Influences Battery Performance

Improving Field Response to Radiological Threats

OMNIS IC for Automated Ion Chromatography

OMNIS IC - Automated Ion Chromatography for Flexible Analysis

F1-GIF™ System for Advanced EELS Analysis

Editorial Highlights

Engineering Solutions for Modern Oil and Gas

Flare Stacks in Oil & Gas Safety

The Carbon Cost: Rethinking Modern Materials

Sponsored Content

Overcoming the AI Adoption Barrier in Materials Development

Automating Microplastic Identification with FTIR Microscopy

New Imaging Method for Particle Monitoring in Electronics Manufacturing

Measuring Thermal Maturity with Vitrinite Reflectance