KEMET Corporation, a leading manufacturer of capacitors based in the United States, and NEC TOKIN Corporation ("NEC TOKIN"), a leading manufacturer of tantalum capacitors based in Japan, announced today the closing of the first step in their alliance with the completion of a capital injection of USD 50 million (approximately JPY 4.4 billion) by KEMET Electronics Corporation, KEMET's wholly-owned subsidiary (collectively with KEMET Corporation, "KEMET"), into NEC TOKIN.
American Semiconductor, Inc. today announced they had received the prestigious 2013 FLEXI Award presented by the FlexTech Alliance at the 12th Annual Flexible Electronics and Displays conference in Phoenix, Arizona.
At the HiPEAC 2013 conference in Berlin, KALRAY demonstrated MPPA256, the world's first supercomputer-on-a-chip, consisting of 256 computing cores. This innovative processor combines the ultimate in several processor types and will enable a whole new class of embedded and industrial applications in the fields of image processing, signal processing, control, communications and data security.
Raytheon today officially "opened for business" a new UK-leading silicon carbide manufacturing "foundry" facility, developed through several years' research into advanced manufacturing processes and materials science. The application of silicon carbide in electronic systems will place the UK in a leading position to develop next-generation, high-efficiency, smaller, low-weight power conversion products used in harsh environments across the automotive, aerospace, geothermal explorations, oil and gas, and clean energy sectors.
New York University physicists have developed a method for moving microscopic particles with the flick of a light switch. Their work, reported in the journal Science, relies on a blue light to prompt colloids to move and then assemble—much like birds flock and move together in flight.
Pulse Electronics Corporation, a leading provider of electronic components, introduces RF MoCA (Multimedia over Cable Alliance) filter modules that are pin-in-paste compatible. Pin-in-paste manufacturing uses a reflow instead of a wave soldering process to apply solder to the components, saving time, increasing throughput, and reducing costs. These filters are compliant with MoCA 1.1 and 2.0 requirements and are qualified with leading MoCA silicon vendors.
3M announced today at DesignCon 2013 the full launch of its Embedded Capacitance Material (ECM) C2006. The ultra-thin laminate material is now available for high-volume manufacturing. With a capacitance density of approximately 20 nF per square inch, the material offers one of the highest capacitance densities currently available on the market in a halogen-free* product.
Indium Corporation technology experts will share their technical expertise at the IPC APEX Expo February 19-21 in San Diego, California.
Voltaix, Inc. a leading manufacturer of specialty materials for the semiconductor and photovoltaic industries, and Linde Electronics, the global electronics business of The Linde Group, announced the signing of an agreement to expand disilane (Si2H6) capacity with the construction of a 40 metric ton Ultra High Purity (UHP) disilane plant.
Rubicon Technology, Inc. a leading provider of sapphire substrates and products to the LED, semiconductor, and optical industries, today announced that it has shipped a total of 400,000 six-inch sapphire wafers to LED manufacturing and SoS/RFIC markets.
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