Northwestern University graduate student Jonathan Barnes had a hunch for creating an exotic new chemical compound, and his idea that the force of love is stronger than hate proved correct. He and his colleagues are the first to permanently interlock two identical tetracationic rings that normally are repelled by each other. Many experts had said it couldn't be done.
KEMET Corporation, a leading manufacturer of tantalum, ceramic, aluminum, film, paper and electrolytic capacitors, today introduced its new T496 Hi-Rel Fused Commercial-Off-the-Shelf (COTS) MnO2 Series of tantalum surface mount capacitors.
Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced immediate availability of its comprehensive solution for FinFET-based semiconductor designs.
Research and Markets has announced the addition of the "2013 U.S. Semi-Conductor & Electronic Components Mfg. Industry-Capital & Expenses Report" report to their offering.
Vishay Intertechnology, Inc. today introduced a new series of molded MICROTAN® solid tantalum chip capacitors for space-constrained consumer electronics. TL8 series devices employ a high-volumetrically efficient packaging solution to enable the industry's highest capacitance-voltage ratings in small case sizes down to 0805 with low profiles from 0.8 mm to 1.0 mm.
Aerospace and defence industries have both a demand and approval to use Non-RoHS electronic components. New generation microprocessors released to the market are predominantly only available in RoHS packaged options, leaving these aerospace and defence applications with a trade-off between the reliability of leaded packages and the improved performance of the latest ROHS compliant processors.
Cybercom is developing solutions and services for Volvo Car’s first connected infotainment solution. The system was unveiled at the global consumer electronics show CES in Las Vegas this week.
Helping customers develop end products requiring on-site connectivity, Texas Instruments Incorporated (TI) today announced its newest 32-bit, real-time C2000™ Piccolo™ F2806xU microcontrollers (MCU) with integrated USB connectivity.
Molex Incorporated continues to meet the needs of today’s design engineers by developing products that provide not only the highest signal speeds and integrity on the market, but also offer flexibility and scalability for next-generation system architectures. Molex will showcase its expertise in various forums at DesignCon 2013, January 28 – 31, 2013, Santa Clara, CA, including several technical paper presentations and ongoing solution demonstrations and product displays in booth 109.
Applied DNA Sciences, Inc., (Twitter: @APDN), a provider of DNA-based anti-counterfeiting technology and product authentication solutions, announced today that Forward Components, Inc. (Forward Components Engineering, or FCE), based in Foothill Ranch, CA, has requested a unique DNA mark from APDN for DNA-marking for FSC 5962 microcircuits in accordance with the mandate issued by the U.S. Defense Logistics Agency (DLA). The mandate requires use of APDN's SigNature® DNA marking on a certain class of microcircuits, FSC 5962.
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