The newest AVIA™ micromachining laser from Coherent, Inc. (Santa Clara, CA) delivers the highest power commercially available at its wavelength and repetition rate. Specifically, the AVIA 355-33 offers 33 Watts of output at 355 nm (at 110 kHz). This high power translates directly into increased production efficiency, thus lowering cost per part.
Today at the Photonics West conference, Dow Corning and IBM scientists unveiled a major step in photonics, using a new type of polymer material to transmit light instead of electrical signals within supercomputers and data centers. This new silicone-based material offers better physical properties, including robustness and flexibility, making it ideal for applications in Big Data and for the development of future exascale computers, which are capable of performing a billion billion computations per second.
Texas Instruments Incorporated (TI) today introduced the industry's first single-chip, front-end power management unit (PMU) for battery-powered applications based on ARM Cortex A9 and A15 processors.
AVX Corporation, a leading manufacturer of advanced passive components and interconnect solutions, has developed a unique new series of high-voltage, conformally coated, radial leaded MLC capacitors for automotive applications.
FlexTech Alliance today announced the recipients of the 2013 FLEXI Awards. American Semiconductor, Corning Incorporated, and Plastic Logic were recognized for significant contributions to innovation and R&D.
Plastic Logic is proud to announce that the company has been awarded the prestigious FLEXI 2013 R&D Award for the development of a scalable manufacturing process for integrating a colour filter array on a flexible plastic display.
KEMET Corporation, a leading manufacturer of capacitors based in the United States, and NEC TOKIN Corporation ("NEC TOKIN"), a leading manufacturer of tantalum capacitors based in Japan, announced today the closing of the first step in their alliance with the completion of a capital injection of USD 50 million (approximately JPY 4.4 billion) by KEMET Electronics Corporation, KEMET's wholly-owned subsidiary (collectively with KEMET Corporation, "KEMET"), into NEC TOKIN.
American Semiconductor, Inc. today announced they had received the prestigious 2013 FLEXI Award presented by the FlexTech Alliance at the 12th Annual Flexible Electronics and Displays conference in Phoenix, Arizona.
At the HiPEAC 2013 conference in Berlin, KALRAY demonstrated MPPA256, the world's first supercomputer-on-a-chip, consisting of 256 computing cores. This innovative processor combines the ultimate in several processor types and will enable a whole new class of embedded and industrial applications in the fields of image processing, signal processing, control, communications and data security.
Raytheon today officially "opened for business" a new UK-leading silicon carbide manufacturing "foundry" facility, developed through several years' research into advanced manufacturing processes and materials science. The application of silicon carbide in electronic systems will place the UK in a leading position to develop next-generation, high-efficiency, smaller, low-weight power conversion products used in harsh environments across the automotive, aerospace, geothermal explorations, oil and gas, and clean energy sectors.
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