TRENDnet, a best-in-class wired and wireless networking hardware brand, announces today from 2013 International CES in Las Vegas, Nevada, the availability of the Powerline 500 AV Nano Adapter with Built-In Outlet, model TPL-407E. This adapter offers a stable high performance network connection to a smart TV, media player, receiver, or computer.
LG Electronics (LG) will introduce its full 2013 line of smart appliances, offering enhanced connectivity and greater user convenience, at next week's International CES® in Las Vegas.
Hyundai returns to the International Consumer Electronics Show (CES) January 8-11, 2013 (North Hall, booth #315) to debut and showcase a number of new vehicle technologies. Along with demonstrations of its Blue Link® telematics and infotainment platform, Hyundai will again preview its next-generation concepts and future infotainment systems for the tech-savvy CES crowd.
Visteon Corporation, a leading global automotive supplier, will display a range of automotive electronics at various stages of development and production at the 2013 International CES – the world's largest consumer technology trade show – in Las Vegas from Jan. 8-11. Visteon's booth is located at CP#20 in the Central Plaza of the Las Vegas Convention Center.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a leading producer of ICs for cable set-top boxes and home gateways, has revealed the first three chips in its new family supporting the DOCSIS 3.0 cable-modem specification.
Integrated Device Technology, Inc. (IDT®), the Analog and Digital Company™ delivering essential mixed-signal semiconductor solutions, today announced that it has earned a Product of the Year award from Electronic Products Magazine and a 2012 Best Electronic Design award from Electronic Design Magazine for its NVM Express (NVMe) enterprise flash memory controller with native support for PCIe® Gen 3.
Answering the question, "How low can you go with power?" Texas Instruments Incorporated (TI) today introduced the industry's lowest power DC/DC step-down converter, which increases the amount of harvested energy an end application can use as much as 70 percent over alternative devices. The ultra-low power circuit enables battery-free power to applications, such as wireless sensor networks, monitoring systems, smoke detectors, wearable medical devices and mobile accessories.
Universal Electronics Inc. (UEI), a worldwide leader in universal remote control technologies and control interfaces, is bringing the latest innovations in universal control and accessories for connected home entertainment to CES 2013.
Each Sunday in January, the Museum of Science is presenting an inside look at MC10’s virtually invisible, conformal electronics technology. Part of its Invented Here! program, the Museum of Science is celebrating MC10 as one of New England’s most innovative companies.
The global market for embedded and standalone non-volatile RAM is poised for explosive growth in the next few years. Magnetoresistive random-access memory (MRAM) and other non-charge storage-based memories including FeRAM continue to outperform charge-based semiconductor storage technologies such as SRAM, DRAM, NOR flash and NAND; but one challenge remains at the forefront: scalability and commercialization. Recent announcements, such as Toshiba's new STT-MRAM prototype, mark a shift in MRAM as in-plane technology is replaced by perpendicularly magnetization methods. The latter uses significantly less current and is capable of functioning on smaller transistor sizes.
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