Henkel to Present Next Generation Formed-In-Place Gasket Liquid Sealant Technology

Download PDF Copy

Apr 17 2009

Henkel will discuss its Next Generation Formed-In-Place Gasket (FIPG) Liquid Sealant for Automotive Intake Manifold Applications in a technical presentation at SAE World Congress and Exposition.

The topic will be presented at 10 a.m. on April 23rd in Room D3-22/23 at COBO Hall by Henkel technical expert, Chiu-Sing Lin. It highlights a study Henkel conducted in collaboration with Honda that shows that polyacrylate FIPG reduces gasoline permeation up to 10 times better than the silicone FIPG.

In addition to the findings of the study, the technical session will also touch upon the adhesion properties of the polyacrylate FIPG sealant on aluminum and magnesium alloys.

"Henkel is committed to developing sustainable technologies that reduce environmental impact while improving performance and quality," said Dan Wohletz, vice president, NA automotive, Henkel. "This new polyacrylate Formed-In-Place Gasket Liquid sealant is an example of such an innovation. We are excited to have had the opportunity to collaborate with Honda on the study of this technology."

Download PDF Copy

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback

(Logout)

Public Comment

Private Feedback to AZoM.com

Submit

Sign in to keep reading

We're committed to providing free access to quality science. By registering and providing insight into your preferences you're joining a community of over 1m science interested individuals and help us to provide you with insightful content whilst keeping our service free.