Dow Electronic Materials Expands to Meet Growing Demand in Asia’s Electronic and Solar Cell Markets

Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE: DOW) will construct a new manufacturing facility in Eastern China to meet the growing material demand to serve printed circuit board (PCB), electronic and industrial finishing, and photovoltaic (PV) markets in Asia.

The new manufacturing facility will be located at the company’s Zhangjiagang site in the province of Jiangsu, approximately 98 kilometers from Shanghai. Construction is expected to begin in late 2010, with production anticipated to beginning in late 2011.

“The expanding demand for computer, communications and consumer electronic products and the focus on renewable energy has resulted in growth in PCB, electronic and industrial finishing, and PV materials markets, especially in Asia,” said Helen Zhang, global general manager, Interconnect Technologies for Dow Electronic Materials. “As a market leader, Dow Electronics Materials is devoted to collaborating with customers to deliver innovative solutions. The new manufacturing facility will enhance our service and technical expertise for customers, as well as our ability to continue to augment our portfolio with high performance products that meet future needs for both electronic and solar cell markets.”

“The PCB, electronic and industrial finishing, and PV markets continue to expand in many parts of Asia, with especially strong growth in China,” said JR Chen, Asia General Manager, Interconnect Technologies for Dow Electronic Materials. "We are committed to supporting local customers efficiently and quickly in product production, delivery, and technical service. Our existing plant in Dongguan in Guangdong province is well-positioned to serve our customers in Southern and Western China, and this new Zhangjiagang manufacturing facility will enhance our supply chain to serve our customers in Eastern and Northern China."

Dow Electronic Materials is the leading supplier of metallization technologies to the PCB, electronic and industrial finishing, and solar cell markets.

Source: http://www.dow.com/

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