Everett Charles Technologies has announced that it will exhibit the new HyperCore at the forthcoming SEMICON West conference and exhibition, which will be conducted from July 10 to 12, 2012, at the Moscone Center located in San Francisco, California.
HyperCore is an in-house base material designed for the fine-pitch, highly scalable ZIP architecture. The material demonstrates 600 Knoop hardness, minimal oxidation and superior conductivity. Moreover, the material’s hardness is equivalent to high carbon steel but has 30% more conductivity. It eliminates the need for expensive metal plating system and is a non-plated homogenous material that resists cleaning wear and deformation.
Everett Charles Technologies will also showcase its extensive portfolio of semiconductor products, which include Bantam and ZIP contacts. ZIP’s high scalability solutions for wide-range of applications will comprise ZIP Z1 and Z2, ZIP SCRUB, ZIP KELVIN, ZIP SUPER SHORT, ZIP Long-Travel, and Z8.
ZIP Z1 and Z2 are superior performance production contacts for typical high-speed applications in 0.3, 0.4, 0.5, and 0.8 mm pitches. The ZIP SCRUB pin has a patented scrub-action. Designs for BGA, pad and leaded applications offer a self cleaning penetrating motion per compression that lengthens the average time between cleaning cycles. ZIP KELVIN is suitable for voltage sensitive device tests or peripheral devices demanding sub-1 ohm resistance measurements, which are normal in high-power and RDSON applications.
ZIP SUPER SHORT is developed for 0.5 nH low impedance, high frequency testing. The ZIP Long-Travel allows rapid customization of travel and OAL as high as 6.7 mm. The Z3 line is designed for applications that need a high degree of compliance for contacting strip packages and large devices. The Z8 is developed for burn-in applications. It features the same form factor as that of the Z1 and Z2 lines, thus enabling flawless shifting from lab characterization to mass production. The ZIP patented 2-D design has planar contact surfaces created by a novel production process, thus offering cost benefits and superior performance.
Source: http://www.ectinfo.com/
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