Jan 18 2013
Molex Incorporated continues to meet the needs of today’s design engineers by developing products that provide not only the highest signal speeds and integrity on the market, but also offer flexibility and scalability for next-generation system architectures. Molex will showcase its expertise in various forums at DesignCon 2013, January 28 – 31, 2013, Santa Clara, CA, including several technical paper presentations and ongoing solution demonstrations and product displays in booth 109.
Technical Paper Presentations
Each of these three 40-minute sessions highlights specific Molex technical and application expertise:
- Tuesday, January 29, 2013, 9:20 a.m. – 10:00 a.m. Ballroom H: Molex experts Gregory Fitzgerald, senior signal integrity engineer; Munawar Ahmad, principal engineer; Mark Bugg, project engineer and Michael Rost, project electrical engineer will discuss skew in twinax cables and its significance in next-generation differential signalling. Both insertion loss deviation and mode conversion will also be reviewed.
- Wednesday, January 30, 2013, 2:00 p.m. – 2:40 p.m. Ballroom E: Rick Brandwein, electrical project engineer, Molex; Glenn Oliver, senior engineer, DuPont; Matt Doyle, signal integrity engineer, IBM; and John Dangler, development engineer, IBM will demonstrate how a focus on advanced flex circuit materials will enable flex circuits to remain valid interconnects. Modeled and measured data will characterize construct performance and “lessons learned" will be presented.
- Thursday, January 31, 2013, 10:40 a.m. – 11:20 a.m. Ballroom G: Peerouz Amleshi, director; Xin Wu, senior engineer and Raghav Nallan Chakaavarthi, electrical engineer with Molex will join Bhavesh Patel, principal engineer, Dell and Casey Morrison, application engineer, Texas Instruments to identify the critical system signal integrity and radiated EMI impact factors of the conventional implementation of AC coupling capacitors in a 25Gbps+ system through 3D modeling, channel simulation and measurement.
Product Demonstrations
The demonstrations will take place in Molex booth 109 and highlight the company’s commitment to developing next-generation solutions for its customers:
- NeoScale™ 28 Gbps Speeds: Adam Stanczak, product development manager, and Vivek Shah, senior electrical engineer, will conduct a live demonstration of the latest derivatives and extensions of the NeoScale connector, a high-speed mezzanine solution that delivers pristine signal integrity at 28 Gbps+ data rates. The demonstration will feature an integrated test board, a Molex connector, a Texas Instruments chip, LeCroy test equipment and cutting edge product extensions of the NeoScale design. For more information, please visit www.molex.com/link/neoscale.html.
- zQSFP+: Joe Dambach, global new product development manager, will demonstrate zQSFP+ stacked thermal management technologies. Wind tunnel testing has been found to offer the most accurate, repeatable test method. Data is generated that will support design of NEBS rated applications with current and next generation pluggable I/O modules. For more information, please visit www.molex.com/link/zqsfp+.html.
- Impel™ Backplane Connector System: Pete Soupir, global new product development manager, will be demonstrating the new Impel backplane technology operating at 25 Gbps over 3 different channel lengths using the Impel reference backplane. The output will illustrate the Impel connector performance in-channel using Megtron 6 and HVLP board material with respective transmit and receive daughtercards. For more information, www.molex.com/link/backplane.htm.
Products Displayed
Molex will display a range of advanced interconnect products, including:
Power:
- EXTreme EnergetiC™ High-Current Connector System: Delivers high-end datacom OEMs and power supply manufacturers with an advanced solution for applications requiring high current up to 100.0A per bay
- EXTreme Guardian™ System: Winner of the 2012 DesignVision Award, the solution features a three circuit, wire-to-board configuration that delivers up to 80.0A of current per circuit, a PCB header with a pitch of 11.00 mm (0.433”) for increased PCB real estate savings and an EMI-shielding option to reduce cable crosstalk and improve immunity to external noise
I/O
- zQSFP+™ Stacked with Thermal Management Component (TMC): Continues to support 100 Gbps Ethernet and 100 Gbps InfiniBand* (IB) Enhanced Data Rate (EDR) applications, the zQSFP+ TMC offers improved thermal performance by cooling both the upper and lower ports in order to conform to NEBS or other applications that required higher ambient temperatures of up to +55ºC
- zQSFP+ iPass+™ zHD Vertical Connector System: Provides a 0.75mm pitch vertical connector that meets requirements of SAS-3 and projected SAS-4 bandwidth
Mezzanine
- NeoScale™ High-Speed Mezzanine System: Offers 2, 4, 6 and 8 row versions with a column range of 4 to 30 columns and stack heights of 12.00 to 42.00mm to support a wide range of mezzanine applications
- SpeedStack™ Connector System: Provides PCB real-estate space savings while optimizing airflow with a low-profile stack height of 4.00mm, achieving up to 40 Gbps per differential pair
Backplane
- Impel™ Backplane Connector System: This scalable backplane product provides OEMs with an upgrade model, so that they can purchase a reduced cost daughtercard that is a viable solution for 16 Gbps, and can upgrade to a plug-compatible daughtercard solution for 25 Gbps or beyond.
- Impact™ XTR Daughter Cards: A daughtercard enhancement of the Impact product family, XTR provides an upgrade path for increased signal integrity margin necessary for evolving high-speed development, supporting 25 Gbps+.
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Source: http://www.molex.com/