Viscom Inc. today announced plans to exhibit at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center in CA. The Viscom Americas team will highlight the S3088 ultra chrome, X7056-II 3D X-ray, and Automatic Inspection Assignment in Booth #920.
The S3088 ultra chrome is based on Viscom’s unique 3D AOI technology, and combines accurate defect detection with high inspection speed. This makes the system the first choice for efficient SMT production.
Some of the market-leading features of the S3088 ultra chrome include inspection speed of up to 65 cm2/s and 65 mega pixels of information in each 50 mm x 50 mm field of view. The resolution is switchable, and with 10 µm per pixel even 03015 components can be reliably inspected. Together with the eight angled-view cameras, a virtually shadow-free 3D inspection is one of the key advantages of the system.
Along with the high-performance hardware, Viscom delivers exciting new software features that enable automatic 3D program generation utilizing an extensive IPC compliant library, Gerber and centroid data to create a precise and comprehensive 3D image. With the unique 360View capability, side views of electronic components can be rendered in True to Life images.
The Award winning X7056-II automatic 3D X-ray inspection
The X7056-II automatic 3D X-ray inspection system features extremely high throughput and superb image quality for the requirements in high-end electronics production.
This new AXI in-line system can ensure precise inspection of hidden solder joints and components in production, including µBGA HIP (head in pillow) defects on bumps down to 0.2mm Ø.
The system is equipped with the xFastFlow transport module, which cuts printed circuit board transfer times. With this feature, up to three boards can be processed at the same time.