ZEISS Xradia 610 and 620 Versa 3D X-ray Microscopy

With the most modern 3D X-Ray microscope models in the ZEISS Xradia Versa series, users may gain new levels of versatility for their scientific and industrial research.

The ZEISS Xradia 610 and 620 Versa stretch the bounds of the non-destructive sub-micron scale imaging by building on industry-best resolution and contrast.

Highlights

Extending the Limits of Micro- and Nano-CT Solutions

• Sub-micron level non-destructive microscopy of fully intact samples
• In situ imaging for non-destructive microstructure characterization throughout, in controlled environments
• Upgradable and expandable in response to future advances and expansions
• True spatial resolution of 500 nm with a voxel size of 40 nm as the smallest attainable size
• Greater flux and quicker scans without sacrificing clarity
• Excellent resolution over a wide variety of sample types, proportions and operational ranges
• Picture quality with high throughput

Highest Resolution and Flux

While standard tomography depends on single-stage geometric magnification, the Xradia Versa employs novel two-stage magnification optics and a high flux X-Ray source to generate quicker sub-micron scale resolution pictures.

The Resolution at a Distance (RaaD) architecture allows for high-resolution 3D imaging of larger, denser objects, such as entire components and equipment. The added flat panel extension (FPX) allows for quick scanning of massive samples (up to 25 kg), as well as navigation to core regions of interest.

New Degrees of Freedom

For advanced scientific and industrial research, use the industry’s most comprehensive 3D X-Ray imaging solution: Increase absorption and phase contrast to accomplish breakthrough material and property characterization.

Diffraction Contrast Tomography can reveal 3D crystallographic information. With sophisticated acquisition techniques, the user can increase the speed and precision of scanning big or irregular samples. Use machine learning methods to assist with sample post-processing and segmentation.

Premier 4D / In Situ Solution

The ZEISS Xradia 600 Series Versa can characterize the 3D microstructure of materials non-destructively (in situ) and analyze the development of formations over time (4D).

The Xradia Versa maintains the best resolution across vast working distances by using Resolution at a Distance, allowing it to accommodate sample, environmental chamber and high precision in situ load rigs without compromising resolution.

To address multi-scale correlative imaging issues, the Versa effortlessly connects with other ZEISS microscopes.

Application Examples 

ZEISS Xradia 610 and 620 Versa at Work 

Electronics and Semiconductor Packaging

Typical Tasks and Applications

• Conduct structural and failure analysis of advanced semiconductor packages, including 2.5/3D and fan-out packages, for process development, yield enhancement and construction analysis.
• Improve comprehension of defect sites and distributions by seeing limitless virtual cross-sections and plan view photos from any angles desired.
• For reverse engineering and hardware security, examine printed circuit boards
• Image non-destructively across length scales from module to package to interconnect for submicron-resolution defect analysis at speeds that can supplement physical cross-sectioning

Visualization of C4 bumps, TSVs, and Cu-pillar micro bumps in a 2.5D package, enabling high-resolution views from within the intact package, 1 µm/voxel. Image Credit: Carl Zeiss Microscopy GmbH

Virtual cross section from the 2.5D package reveals solder cracks and voids in C4 bumps. Image Credit: Carl Zeiss Microscopy GmbH

DRAM package interconnects within a 10 mm X 7 mm X 1 mm package containing a 4-die stack. Solder extrusion is easily visualized in 3 dimensions, 0.8 µm/voxel. Image Credit: Carl Zeiss Microscopy GmbHs

Virtual cross section of micro bumps in a DRAM package. TSVs are 6 μm in diameter and micro bumps average 35 µm in diameter. Small solder voids of 2 μm are visible. Image Credit: Carl Zeiss Microscopy GmbH

Lithium-Ion Batteries

Typical Tasks and Applications

• Recipe creation and supply chain management: Assessment of intact samples for efficient supplier control, revealing recipe alterations or cost savings that may impair effectiveness or longevity.
• Lifetime and aging impacts: Longitudinal studies on the effects of aging
• Assessment for safety and quality: Identifying debris, particle development, burrs at the electrical contact or damage to the polymer separator.

Intact cylinder cell (160 kV) — welding burrs, metallic inclusions, folds and kinks in conductive layers. Image Credit: Carl Zeiss Microscopy GmbH

Large pouch cell (120 kV) — failure analysis, swelling, wetting, electrolyte gas evolution. Image Credit: Carl Zeiss Microscopy GmbH

Small pouch cell (80 kV) — in situ microstructure, aging effect at cathode grain level, separator layer. Image Credit: Carl Zeiss Microscopy GmbH

Small pouch cell: 0.4X overview scan; 4X Resolution at a Distance; 20X Resolution at a Distance. Image Credit: Carl Zeiss Microscopy GmbH

Additive Manufacturing

Typical Tasks and Applications

• To identify optimal process parameters, a detailed shape, size and volume distribution analysis of particles in an Additive Manufacturing (AM) powder bed is performed
• Microstructural study of AM parts using high-resolution, non-destructive imaging
• 3D imaging for comparison with the nominal CAD model
• Surface roughness study of interior components that are inaccessible via other methods
• Unmelted particles, high-Z inclusions and voids are detected.

Surface roughness evaluation of an AM printed duct (Ti-6Al-4V); high resolution scan acquired at ~1.7 mm voxel over a ~3.4 mm area. Image Credit: Carl Zeiss Microscopy GmbH

Imaging of different A205 AM powder qualities at 3.9 µm voxel resolution. Image Credit: Carl Zeiss Microscopy GmbH

Inner structure of an AM manufactured aluminum gear wheel; 3 µm voxel resolution imaging is used to see unmelted particles, High-Z inclusions, and small voids. Image Credit: Carl Zeiss Microscopy GmbH

ISO 25178 surface roughness evaluation of a Ti-6Al-4V test sample. Results are very similar between XRM and ZEISS Smartproof 5 confocal microscope. Image Credit: Carl Zeiss Microscopy GmbH

Materials Research

Typical Tasks and Applications

• Illustrate the three-dimensional structure
• Examine characteristics at various length scales
• Examine the failure processes, degradation occurrences and internal flaws
• Microstructural evolution will be quantified
• Conduct in situ and 4D time-dependent investigations to comprehend the effects of heating, desiccation, cooling, wetting, compression, tension, drainage, imbibition and other simulated environmental research

Additive manufactured lattice structure. Image Credit: Carl Zeiss Microscopy GmbH

Porous glass foam insulation imaged at multiple length scales. Image Credit: Carl Zeiss Microscopy GmbH

Carbon fiber reinforced polymer composite. Image Credit: Carl Zeiss Microscopy GmbH

Localized high resolution tomography and segmentation of multiple phases in concrete. Image Credit: Carl Zeiss Microscopy GmbH

Raw Materials

Typical Tasks and Applications

• Analyze pore structure and fluid flow at several scales
• Using in situ flow technology, directly monitor fluid flow at the pore scale
• Using LabDCT Pro, examine crystal formations
• Particle analysis with full three-dimensional reconstruction
• Improve mining processes by analyzing tailings in order to maximize mining efforts; conducting thermodynamic leaching studies; and doing QA/QC analysis on mining products such as iron ore pellets
• Learn about the grain orientations of steel and other metals

Individual gold grain identified from a population of ~26,000 pyrite grains. Image Credit: Carl Zeiss Microscopy GmbH

Multiscale non-invasive characterization of sandstone core, showing high quality non-invasive interior tomography and integrated pore scale analytical investigation (showing pore separation). Image Credit: Carl Zeiss Microscopy GmbH

Traditional absorption contrast image of disaggregated olivine. Image Credit: Carl Zeiss Microscopy GmbH

Individual sub-crystals identified using LabDCT Pro on disaggregated olivine. Image Credit: Carl Zeiss Microscopy GmbH

Life Sciences

Typical Tasks and Applications

• 3D imaging of biological samples in their native environment
• Without any special sample preparation, imaging of plant roots that are still entrenched in their native soil
• Imaging of delicate animals and plants without sample preparation or sectioning
• Sub-micron photography of solid things, such as seeds in their entirety

The XRM micrograph of a blossom reveals its components in a new 3D view. Sepals (yellow) and petals (purple) can be distinguished. Image Credit: Carl Zeiss Microscopy GmbH

Dragonfly imaged in its native structure without any sample preparation and sectioning. Image Credit: Carl Zeiss Microscopy GmbH

Seeds are very solid and compact structures and their inside is difficult to image as a whole. The image shows the pre-shaped seed leaves which will contain the energy reservoir for the further grow of the plant. Image Credit: Carl Zeiss Microscopy GmbH

Embedded plant root in soil: the root can be recognized as a dominant structure within the soil which consists of grains of different sizes and shapes. Voxel size: 5.5 µm. Image Credit: Carl Zeiss Microscopy GmbH

Technology Insights

Non-destructive Imaging with Best-in-Class Resolution and Contrast

Highest Resolution without Compromise

Due to the geometric nature of magnification, standard X-Ray computed tomography (CT) is restricted to small sample sizes when imaging at high resolution. Sustaining high resolution for bigger samples is challenging due to the extended working distances required.

High resolution imaging in CT systems necessitates low X-Ray flux, which reduces measuring throughput. This limits the practical use of most CT manufacturers’ advertised maximum resolution.

Xradia 600 Series by ZEISS Versa tackles these trade-offs by combining dual-stage magnification with high flux X-Ray source technology.

True spatial resolution is specified by ZEISS, giving a consistent measure of microscope performance to 3D X-Ray measurement. The minimal separation at which two characteristics can be rectified by an imaging system is referred to as spatial resolution. The true spatial resolution of 500 nm is achieved by ZEISS Xradia 600 Series Versa systems with a minimum possible voxel size of 40 nm.

Image Credit: Carl Zeiss Microscopy GmbH

Higher X-Ray Flux Source

Numerous Advantages

The ZEISS Xradia 600 Series Versa features a ground-breaking high power (25 W) X-Ray source technology capable of providing much more X-Ray flux than its predecessors.

With enhanced thermal management, greater flux and throughput and resolution efficiency, the new source pushes the bounds of performance. A new source management system increases source responsiveness, allowing for faster scan setup and a more enjoyable user experience.

What a higher X-Ray flux provides:

• Faster tomography scans
• More areas of interest
• More sample runs
• More pronounced diffraction patterns
• Increased contrast-to-noise ratio
• Long/multi-scan workflows are now possible (in situ, DSCoVer, stitching, DCT)

ZEISS Xradia 620 Versa X-Ray source. Image Credit: Carl Zeiss Microscopy GmbH

ZEISS X-Ray Microscopes

The Versatile Advantage of RaaD

The ZEISS Xradia Versa has a two-stage magnification design to achieve sub-micron resolution imaging at long working distances (Resolution at a Distance) for a wide range of sample sizes and kinds.

Images are first magnified by geometric projection, as they are in traditional microCT, and then cast onto a scintillator, converting X-Rays to visible light images, which are then optically magnified using microscope optics before being acquired by a CCD detector.

With more X-Ray photons accessible, the ZEISS Xradia 600 Series Versa delivers faster results for the greatest variety of sample sizes and kinds, without sacrificing resolution.

Image Credit: Carl Zeiss Microscopy GmbH

Conventional microCT Architecture

Sample must be close to the source to achieve resolution. Image Credit: Carl Zeiss Microscopy GmbH

ZEISS XRM Two-stage Magnification Architecture

Sample imaged independent of distance to source, enabling interiors of larger samples to be imaged non-destructively at higher resolution. Image Credit: Carl Zeiss Microscopy GmbH

Accessories

Extend the Range of Possibility for Advanced Material Characterization in 3D

ZEISS Advanced Reconstruction Toolbox

Better image quality, higher throughput.

Image Credit: Carl Zeiss Microscopy GmbH

Artificial Intelligence (AI)-driven reconstruction methods are introduced by Advanced Reconstruction Toolbox (ART) on the ZEISS Xradia 3D X-Ray microscope (XRM) or microCT. A better comprehension of both X-Ray physics and applications enables users to tackle some of the most difficult imaging problems in novel and creative ways.

Discover how OptiRecon, two variations of DeepRecon, and PhaseEvolve, ART’s unique modules, improve data acquisition, reconstruction speed and image quality without losing resolution.

The user can use the Advanced Reconstruction Toolbox to:

• Enhance data collecting and analysis for more accurate and timely decision-making
• Improve image quality
• Achieve superior interior tomography or throughput on a wide range of samples
• Enhanced contrast-to-noise ratio reveals tiny differences
• Increase the speed of sample classes that require repetitive workflow by an order of magnitude

For easy access and usability, the optional modules are workstation-based solutions: 

• DeepRecon Pro & Custom for Deep learning-based reconstruction
• OptiRecon for iterative reconstruction
• PhaseEvolve for contrast enhancement

Image Credit: Carl Zeiss Microscopy GmbH

ZEISS DeepRecon Pro provides a straightforward, uncomplicated, and powerful application of AI and deep neural network technology for enhancing X-Ray tomography results without prior knowledge of deep learning technology. [...] It helps us to reduce the scan time required for in situ fluid-rock interaction experiments when we need to work with long exposure times.

Dr. Markus Ohl, X-Ray microscopy, EPOS-NL MINT, Utrecht University, NL

LabDCT Pro

Unlocking Crystallographic Information

LabDCT Pro for diffraction contrast tomography (DCT), which is only accessible on the Xradia 620 Versa, allows for non-destructive 3D imaging of grain orientation and microstructure. The ability to directly visualize 3D crystallographic grain orientation adds a new level to the characterization of polycrystalline materials, such as metal alloys, geomaterials, ceramics and medicines.

• LabDCT Pro enables specimens with crystal structures ranging from cubic symmetry to lower symmetry systems, such as monoclinic materials
• Using the dedicated 4X DCT objective, collect high-resolution crystallographic data. Use large area mapping for even larger samples, and the Flat Panel Extension to boost throughput (FPX)
• Obtain detailed 3D microstructure analysis from greater representative volumes and a variety of sample shapes
• Experimentation with 4D imaging to study microstructural evolution
• Combine 3D crystallographic data with 3D microstructural information
• To comprehend structure-property interactions, combine modalities

Non-destructive three-dimensional grain map of an Armco iron sample with illustrations of the various grain analysis that can be performed on a typical LabDCT Pro dataset. Image Credit: Carl Zeiss Microscopy GmbH

Flat Panel Extension

With high throughput, image significantly larger samples.

The optional Flat Panel Extension (FPX) provides large-sample, high-throughput scanning with ZEISS’s finest image quality. With an all-in-one solution for industrial and academic research, FPX improves imaging flexibility and workflow efficiencies.

Scout-and-Zoom is a ZEISS X-Ray microscope capability that uses FPX to do exploratory “Scout” scans across a longer range to find interior regions of interest for higher resolution “Zoom” scans without requiring complex sample processing.

FPX also provides LabDCT Pro’s high throughput and vast area mapping capabilities.

Three-stage Scout-and-Zoom workflow. Image Credit: Carl Zeiss Microscopy GmbH

in situ Experiments

Push the limits for scientific advancement.

ZEISS Xradia X-Ray systems offer the industry’s most comprehensive 3D imaging solution for a wide range of in situ rigs, including high pressure flow cells, strain, pressure and heat stages.

Extending research beyond the three dimensions of space, use the non-destructive nature of X-Ray analysis to extend studies into the dimension of time with 4D experiments. The ZEISS Xradia XRM platforms can support a wide range of in situ rigs, including highly pressurized flow cells, tension, compression and temperature stages, as well as user-customized designs.

The user may upgrade the ZEISS Xradia XRM with the optional in situ Interface Kit, which contains a mechanical integration kit, a strong wiring guide and other facilities (feed-throughs), as well as recipe-based software that simplifies operation from inside the Scout-and-Scan user interface.

When the resolution boundaries of the in situ studies need to be pushed, convert the ZEISS Xradia XRM to an Xradia 620 Versa X-Ray microscope to take advantage of Resolution at a Distance (RaaD) technology for the highest performance tomographic imaging of samples within in situ chambers or rigs.

Tensile testing of laser welded steel under increasing load. Image Credit: Carl Zeiss Microscopy GmbH

SmartShield

Protect the Sample Easily to Optimize Experiment Setup

SmartShield is a solution that safeguards the sample as well as the microscope. This automated collision avoidance system operates in conjunction with the Scout and Scan Control System. It allows managing Xradia Versa with greater assurance than ever before. SmartShield builds a digital protective coating depending on the dimensions of the sample with the touch of a button.

SmartShield provides the following advantages:

• Improved operator efficiency is made possible by a simplified sample setup
• Improved user experience for both novice and experienced users
• Keeping important samples and investments safe
• Scan clarity that is unmatched

Metrology Extension

Increasing the Accuracy of Measurement in X-Ray Microscopy

The Metrology Extension (MTX) transforms Xradia 620 Versa into a certified measurement accuracy solution that goes well beyond the limitations of standard CT technology. This is critical for academic and industrial labs, where component downsizing and integration are driving an increasing demand for high-resolution metrology. Take advantage of high-resolution X-Ray imaging paired with accurate metrology.

XRM Check: ZEISS has developed a (multi-sphere) length standard for verifying the accuracy of the CT measurements of small-scale dimensions. Image Credit: Carl Zeiss Microscopy GmbH

Reveal Smallest Dimensions

Measure them most accurately

• Leading CT metrology precision: When calibrated with MTX, the ZEISS Xradia Versa has a market-leading maximum permitted error value of MPESD = (1.9 + L/100) μm for measurements in small-scale volumes, where L is the measured length in millimeters.
• Compact volumes, high resolution: MTX enables high-dimensional accuracy measurements within 125 mm³ reconstructed volumes.
• Calibration workflow is simple: The MTX package includes an integrated user-guided calibration workflow.
• Following the execution of the calibration routine, the user performs precise measurements and makes the results available to standard metrology software for further processing.

Non-contact, non-destructive measurement of a smartphone camera lens module. Image Credit: Carl Zeiss Microscopy GmbH

Autoloader

Improve the efficiency of sample handling.

Autoloader option enables to program up to 70 samples at a time to run sequentially. Image Credit: Carl Zeiss Microscopy GmbH

Increase the usage of the instrument with the optional Autoloader, which is available for all instruments in the ZEISS Xradia X-Ray microscope platforms.

By queueing numerous jobs, users may reduce the frequency of involvement while increasing efficiency. They can load up to 14 sample stations, each of which can hold up to 70 samples, and schedule them to run overnight or over numerous days.

Mechanical stability unprecedented in the industry permits high volume quantitative repeated scanning of similar samples.

Wide Field Mode

Image larger samples with greater flexibility.

Image large samples with Wide Field Mode such as this 6” stereo speaker. Image Credit: Carl Zeiss Microscopy GmbH

Wide Field Mode (WFM) can be used to capture images with a large lateral field of view. For big samples, the wide lateral field of view can provide a 3x larger 3D volume or a higher voxel density than a standard field of view.

WFM, with the 0.4x objective, is available on all Xradia Versa systems. WFM, with a 4x objective, is also included in the Xradia 620 Versa system. WFM, when used with Vertical Stitching, allows users to photograph larger samples at high quality.

Automated Filter Changer

Simplify the examination of difficult samples.

The Automated Filter Changer (AFC) offers 12 standard filters with room for 12 custom filters. Image Credit: Carl Zeiss Microscopy GmbH

To optimize contrast, X-Ray source attenuation filters are employed to control the X-Ray energy spectrum illuminating the sample, which is dependent on the unique material qualities of the sample. Every ZEISS Xradia Versa comes with a set of 12 filters as standard.

The ZEISS Xradia 610 Versa has a single filter slot for manual filter changing. The Automated Filter Changer (AFC) on ZEISS Xradia 620 Versa systems promotes simplicity of use by offering seamless filter changes for convenient investigation of unfamiliar materials.

The Xradia 600 Series Versa

Source: Carl Zeiss Microscopy GmbH

^a ZEISS Xradia 2D resolution target, normal field mode, and optional 40x objective were used to test spatial resolution.
^b The RaaDTM working distance is defined as the clearance around the rotating axis.
^c Voxel is a geometric word that adds to resolution but does not determine it, and is used solely for comparative purposes.
The genuine overall measurement of instrument resolution, as defined by ZEISS, is spatial resolution.

Protect the Investment

To preserve customers’ investments, ZEISS X-Ray microscopes are designed to be upgradeable and extendable with future advancements and improvements. This ensures that the microscope’s abilities improve in tandem with advances in cutting-edge technology.

Consumers can field-convert their systems to the newest X-Ray microscopes by using ZEISS Xradia Context microCT, ZEISS CrystalCT, ZEISS Xradia 510/520 Versa and now ZEISS Xradia 610/620 Versa.

Image Credit: Carl Zeiss Microscopy GmbH

Software

Use the Simple Control System to Create Efficient Workflows

Within the Scout-and-Scan Control System, the user may easily scout a region of interest and specify scanning parameters. Take full advantage of the simple system in the central lab, where users may have varying degrees of competence.

Users can take advantage of:

• Internal camera for viewing samples
• Recipe management (set, save, recall)
• Various energies
• Autoloader option for several samples
• Micropositioning is possible with a single mouse clicks

Scout-and-Scan Control System. Image Credit: Carl Zeiss Microscopy GmbH

ZEISS Mineralogic - Automated Mineralogy

With ZEISS SEM, XRM, and microCT systems, phase identification and textural examination in 2D and 3D can be done.

Image Credit: Carl Zeiss Microscopy GmbH

Visualization and Analysis Software

ZEISS suggests Dragonfly Pro from Object Research Systems (ORS) — a cutting-edge analysis and visualization software solution for 3D data obtained by different technologies along with X-Ray, SEM, FIB-SEM and helium ion microscopy.

ORS Dragonfly Pro, which is available solely through ZEISS, provides a complete, intuitive and customizable toolkit for the analysis and visualization of huge 3D grayscale data. It enables annotation, navigation and media files’ creation, with video production, of 3D data. Conduct image processing, segmentation and object examination to measure the results.

Image Credit: Carl Zeiss Microscopy GmbH