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Sinopec and BASF Establish Isononanol Plant in China for Next-Generation Plasticizers

BASF and China Petroleum & Chemical Corporation (“Sinopec”) have completed a joint feasibility study and taken the next steps in the establishment of a world-scale isononanol (INA) plant in Maoming, Guangdong, China.

From BASF Corporation 23 Jan 2013

Coated Cotton Collects Water from Misty Air

Researchers at Eindhoven University of Technology (TU/e) together with researchers at the Hong Kong Polytechnic University (PolyU), have developed a special treatment for cotton fabric that allows the cotton to absorb exceptional amounts of water from misty air: 340 % of its own weight.

23 Jan 2013

New Canadian Distribution Partner For Freeman Technology

In a move that reflects sustained sales growth throughout North America, powder characterisation company Freeman Technology (Tewkesbury, UK) has appointed ATS Scientific Inc. as its distributor for Canada. Headquartered ...

From Freeman Technology 22 Jan 2013

Imec, Cadence Demonstrate 3D Memory-on-Logic DFT Solution at European 3D TSV Summit

At the European 3D TSV Summit in Grenoble, France on January 22-23, 2013, imec, a world-leading nano-electronics research institute, today announced that together with Cadence Design Systems they have developed, implemented and validated an automated 3D Design-for-Test (DFT) solution to test logic-memory interconnects in DRAM-on-logic stacks. The solution, based on Cadence® Encounter® Test technology, was verified on an industrial test chip containing a logic die and a JEDEC-compliant Wide-I/O Mobile DRAM.

From IMEC 22 Jan 2013

Lattice Semiconductor Announces Array of Advancements to FPGA Design Software Platforms

Lattice Semiconductor Corporation today announced an array of advancements to its software platforms, debuting new versions of Lattice Diamond® and iCEcube2™ design tools. The updated software prominently features several notable advancements that improve power calculations and design productivity aimed at the creation of mobile and consumer, communication, and industrial systems that undergo fast design cycles, demand power efficiency, and have aggressive cost constraints.

22 Jan 2013

Comprehensive Report on Global and China Carbon Fiber Industry

Reportlinker.com announces that a new market research report is available in its catalogue: Global and China Carbon Fiber Industry Report, 2012-2015

From Report Linker 22 Jan 2013

Cebu Pacific Air Buys A320 with Fuel-Saving Wing Tip Device

Cebu Pacific Air took delivery of its first A320 equipped with Sharklets today during a ceremony in Manila, becoming the first operator of the new fuel-saving wing tip devices in the Philippines.

22 Jan 2013

Dow Corning, Crystal Solar Plan to Develop Business Relationship

Dow Corning, a global leader in silicones, silicon-based technology and innovation, and Crystal Solar, a solar energy venture company focusing on Direct Gas to Wafer™ technology, today announced their intention to develop a business relationship for the successful supply of high-performance, silicon-based materials for photovoltaic (PV) cells and modules.

From Dow Corning 22 Jan 2013

Thomson Reuters Names Texas Instruments as a Top 100 Global Innovator

Texas Instruments Incorporated (TI) today announced the company has been named a Thomson Reuters 2012 Top 100 Global Innovator. The program, an initiative of the IP Solutions business of Thomson Reuters, honors corporations and institutions around the world that are at the heart of innovation.

22 Jan 2013

Capital & Expenses Report on US Semiconductor & Electronic Components Manufacturing Industry

Research and Markets has announced the addition of the "2013 U.S. Semi-Conductor & Electronic Components Mfg. Industry-Capital & Expenses Report" report to their offering.

From Research and Markets 22 Jan 2013

New Series of MICROTAN Solid Tantalum Chip Capacitors from Vishay Intertechnology

Vishay Intertechnology, Inc. today introduced a new series of molded MICROTAN® solid tantalum chip capacitors for space-constrained consumer electronics. TL8 series devices employ a high-volumetrically efficient packaging solution to enable the industry's highest capacitance-voltage ratings in small case sizes down to 0805 with low profiles from 0.8 mm to 1.0 mm.

22 Jan 2013

WARDJet Partners With The Advanced Manufacturing Research Centre

WARDJet Inc., an innovative designer and manufacturer of waterjet and CNC platforms, is an Ohio based business expanding its reach beyond the region and even the country. WARDJet has partnered with the Advanced Manufactu...

From WARDJet - Waterjet Cutting Machines 21 Jan 2013

Surface Engineering Of Polymeric Biomaterials Released By Smithers Rapra

Smithers Rapra Publishing has announced the release of ‘Surface Engineering of Polymeric Biomaterials’. Biomaterials work in contact with living matter and this gives a number of specific requirements for their s...

21 Jan 2013

e2v Offers Qualified QorIQ Processors with SnPb Lead Finish

Aerospace and defence industries have both a demand and approval to use Non-RoHS electronic components. New generation microprocessors released to the market are predominantly only available in RoHS packaged options, leaving these aerospace and defence applications with a trade-off between the reliability of leaded packages and the improved performance of the latest ROHS compliant processors.

21 Jan 2013

PPI Readers Select Ecolab Company, Nalco as Preferred Paper Industry Supplier

For the third consecutive year, Nalco, an Ecolab company, was selected as a preferred supplier for the paper industry by readers of Pulp & Paper International (PPI) magazine, a leading industry trade publication.

21 Jan 2013