Intertronics provides quality adhesive solutions for high performance, high technology assembly industries. The company develops products to address the constantly-varying demands of the industry.
WALLTITE Eco polyurethane foam insulation or air barrier system from BASF was recognized at the second yearly Concours Écoconception 2012, an event that honors new and sustainable programs in Quebec. This event was conducted at l’eXcentris Cinema Theatre located in Montreal, Quebec.
STATS ChipPAC, a major provider of semiconductor packaging test, design, assembly and distribution solutions, has reported that its cutting-edge flip chip packaging technology called fcCuBE technology featuring improved assembly processes, bond-on-lead interconnection and copper column bumps is under large-scale production for numerous customers.
By Nick Gilbert
10 Jul 2012
Research and Markets has reported the inclusion of a new report titled ‘Global Packaging Survey 2012-2013: Market Trends, Buyer Spend and Procurement Strategies in the Global Packaging Industry’ to its catalogue.
By Nick Gilbert
10 Jul 2012
As demonstrated at the recent European Society for Precision Engineering and Nanotechnology (EUSPEN) 12th International Conference and Exhibition in Sweden, Olympus continues to provide expertise to the material science community.
The Pittcon Exposition Committee is now accepting booth space reservations for Pittcon 2013, which will be held March 17-21, at the Pennsylvania Convention Center in Philadelphia, PA.
Frost & Sullivan reports a huge growth potential for thin film batteries. It estimates the market to grow to $1,986.5 million in 2018 from $86.7 million in 2011. Thin film batteries are suitable for ultra-thin devices.
By Dr. Cameron Chai
9 Jul 2012
During the opening ceremony of the European Society of Glass Science and Technology conference conducted on June 4, 2012, in Maastricht, Corning’s Dr John C. Mauro has earned the first SGT – Alastair Pilkington Early Career Award for his work on the development and expansion of computer simulation applications in many facets of glass science.
By G.P. Thomas
9 Jul 2012
Teijin has declared that Teijin CNF Korea has commenced the manufacturing of LIELSORT, a new separator for use in lithium ion secondary batteries (LIBs). Teijin CNF Korea is an Asan-based joint venture established between CNF, a main film processor in Korea, and Teijin. LIELSORT was developed by Teijin.
TDK has reported that it has developed a wireless power transfer coil unit specifically designed for use in smartphones and other mobile devices. The receiving coil can be integrated into smartphones. It has a width of just 0.57 mm.
By Nick Gilbert
9 Jul 2012
Outokumpu LDX 2101 material has received official approval for use in building pressure equipment. While utilizing LDX 2101 having dimensions less than 10 mm, manufacturers may check the European Approval of Material (EAM) to meet the specifications set by the European Pressure Equipment Directive (PED).
International sustainable resins supplier, Cardia Bioplastics Limited, and leading rigid plastic packaging company, Alto Packaging, have announced a strategic partnership to produce high performance packaging solutions with environmental benefits.
Valtech, a worldwide manufacturer of specialty chemicals and high-performance products, has declared that it is establishing two additional global sites for manufacturing and distribution.
By G.P. Thomas
7 Jul 2012
BASF has announced that it is planning the expansion of the vinylformamide (VFA) manufacturing facility in Ludwigshafen. The company has planned to increase the capacity of the polymerization process in Ludwigshafen and also intends to construct a new VFA polymerization line in China in order to carry out additional feedstock processing from Ludwigshafen.
Kaman Industrial Technologies (KIT), a subsidiary of Kaman, has acquired Miami, Florida-based Florida Bearings, a distributor of bearings, pump and power transmission products.