Shimadzu’s new GCMS-TQ8030 triple quadrupole gas chromatograph mass spectrometer offers a solution to these challenges along with the speed, accuracy and ease of operation that scientists want.
Nemaska Lithium has announced that two US patents have been filed for its unique process to manufacture lithium carbonate and lithium hydroxide. The company filed the US patent 61/636,869 on 23 April, 2012 to protect its method of preparing high-purity lithium sulphate and lithium hydroxide at low cost.
By G.P. Thomas
6 Jun 2012
Engineered Material Systems (EMS), a global provider of electronic materials for use in circuit assembly applications, has declared that 535-10M-1 UV Cured Adhesive has been added to the company’s broad product line of electronic materials and has been formulated in such a way that it can be used in optoelectronic and circuit assembly, and disk drive camera module applications.
By Nick Gilbert
6 Jun 2012
Commercial Metals (CMC) has reported that the company has sold its Croatian Pipe Mill and CMC Sisak, CMC’s wholly-owned subsidiary, according to a definitive purchase agreement signed between CMC and Danieli Group.
By Dr. Cameron Chai
6 Jun 2012
Asahi Kasei Plastics has announced that a new sales office has been opened in Mexico in order to extend its presence globally. The company is also celebrating 12 years of growth with this new facility. The new plant is strategically situated in the Metepec Business Center of Toluca and complements the company’s four warehouses located in Monterrey, Puebla, San Luis Potosi and Torreon.
Reportlinker.com has added China Structural Adhesive Industry Report, 2011-2012, to its market research catalogue.
Corning has introduced a super-slim flexible glass that could redefine the face of future consumer electronic technologies. The announcement was made by the company at the SID’s Display Week, a popular industry exhibition in Boston.
By G.P. Thomas
6 Jun 2012
Kuraray, a company dealing in specialty chemicals and functional materials, has set up a new Polyvinyl Alcohol (PVOH) resin manufacturing facility at Kuraray America, its U.S. subsidiary.
By Nick Gilbert
6 Jun 2012
Nordson, a company specializing in precision technology solutions, has signed a definitive agreement to purchase Xaloy Superior Holdings, a New Castle, Pennsylvania-based company that produces melt delivery components for extrusion and injection machinery in the worldwide plastic processing industry.
By Nick Gilbert
6 Jun 2012
AKHAN Technologies and Argonne National Laboratory’s Center for Nanoscale Materials (CNM) have teamed up for the complete characterization of the innovative Miraj Diamond materials and devices.
By Nick Gilbert
6 Jun 2012
SAE International has issued Aerospace Material Specification 6509 for Ferrium C64, a high-hardness, high-strength, high-temperature-resistant, carburizing-grade steel that was computationally designed by QuesTek Innovat...
Recession has affected the global demand for lumber in 2008 and 2009, which has enabled the worldwide trade of softwood lumber to increase by 25 percent more than the past two years. China, Spain, South Korea and Japan witnessed a significant rise in import volumes between 2010 and 2011, whereas key importers such as US, Egypt, France, Italy and UK reduced imports by between 5-10 % year after year.
By Nick Gilbert
5 Jun 2012
Chelsea Decorative Metal Company from Houston, Texas distributes and manufactures pressed tin ceilings that have original designs and existed way back in the 1800s. Home remodelers are fascinated to know that these antique designs are still being offered in the market. The stamping of these designs is performed on a 600 ton press, resulting in good quality.
By Dr. Cameron Chai
5 Jun 2012
Molded Fiber Glass Companies is unveiling its new brand MFG Wind, which embodies the complete set of wind-focused capabilities offered by the company, at the American Wind Energy Association's Conference & Exhibition being conducted from June 3 to 6, 2012 in Atlanta.
By G.P. Thomas
5 Jun 2012
Sandia National Laboratories has devised an innovative materials approach to ceramic-based, multilayered three-dimensional microelectronics circuits, like those employed in mobile phones.