Engineered Material Systems (EMS), a global provider of electronic materials for use in circuit assembly applications, has declared that 535-10M-1 UV Cured Adhesive has been added to the company’s broad product line of electronic materials and has been formulated in such a way that it can be used in optoelectronic and circuit assembly, and disk drive camera module applications.
535-10M-1 UV Cure Adhesive offers stress at very low level and has low glass transition temperature. The material is specifically designed to avoid sliders crowning in head gimbal assemblies. Other bonding applications in the head stack assembly can utilize this material. Additionally, this adhesive can be used for chip encapsulation in smart cards, lens bonding applications in camera modules, and many other general bonding in photonics assembly.
This new nonconductive adhesive cures at a faster rate, when it is exposed to high-intensity UV light. This flexible 535-10M-1 adhesive contains no antimony and is a high-strength, low outgassing epoxy adhesive.
The company specifically developed the 535-10M-1 adhesive to meet the strict demands for reliability in camera module, circuit assembly, disk drive and photonics applications.
The technology of Engineered Materials Systems focuses on electronic materials for use in the product line of circuit assembly, camera module, semiconductor, disk drive, printer head, photovoltaic and photonics assembly.