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Optimization Algorithms for Solving Large-Scale Problems may Get a Boost from 2D Materials

Optimization Algorithms for Solving Large-Scale Problems may Get a Boost from 2D Materials

Researchers Observe the First Moments of Polymer Coil-to-Globule Transition

Researchers Observe the First Moments of Polymer Coil-to-Globule Transition

New Perovskite/Organic Tandem Solar Cells Achieve a Power Conversion Efficiency of 23.6%

New Perovskite/Organic Tandem Solar Cells Achieve a Power Conversion Efficiency of 23.6%

Clip-off Chemistry: A Powerful Novel Strategy for Synthesising New Materials

Clip-off Chemistry: A Powerful Novel Strategy for Synthesising New Materials

Phonon Anharmonicities in Graphene for Nanoelectronics Devices

Phonon Anharmonicities in Graphene for Nanoelectronics Devices

Oxide Particle Modeling During 3D Printing

Oxide Particle Modeling During 3D Printing

Combining Exhaust Gas from EGR and Waste Plastic Oil in Diesel Engines

Combining Exhaust Gas from EGR and Waste Plastic Oil in Diesel Engines

Role of Circularity Indicators in Transitioning to an Electrical Circular Economy

Role of Circularity Indicators in Transitioning to an Electrical Circular Economy

Sustainable Materials in Geotechnical Design

Sustainable Materials in Geotechnical Design

Molecular Dynamics Inform Ideal Tool Shape for Nanofabrication

Molecular Dynamics Inform Ideal Tool Shape for Nanofabrication

Atropisomeric Conjugated Diimides in Semiconductors

Atropisomeric Conjugated Diimides in Semiconductors

Novel Method Doubles the Efficiency of Widely Used Industrial Catalysts

Novel Method Doubles the Efficiency of Widely Used Industrial Catalysts

Novel Antibacterial and Antiviral Material as a Cellulose Wipe

Novel Antibacterial and Antiviral Material as a Cellulose Wipe

Trends in Flexible Wearable Sensors for Arrhythmia Diagnosis

Trends in Flexible Wearable Sensors for Arrhythmia Diagnosis

Improving Thermal Interface Materials for Heat Management in Electronics Packaging

Improving Thermal Interface Materials for Heat Management in Electronics Packaging

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