Cadence Design Systems, Inc., a leader in global electronic design automation, today announced that Faraday Technology Corp., based in Hsinchu, Taiwan, deployed a full Cadence® tool flow to create its largest System-on-Chip (SoC), a 300-million-gate design for a 4G base station. By using Cadence Encounter® digital design tools in Faraday’s hierarchical flow, the design team completed this complex SoC, from data-in to tapeout, in just seven months.
NXP Semiconductors N.V., the global leader in secure banking and eGovernment deployments, today launched its new SmartMX2-P40 platform of chip card microcontrollers for large-scale projects in the rapidly growing banking and electronic-Government (eGov) markets.
Universal Electronics Inc. (UEI) today announced that its wholly owned subsidiary, UEI Brasil Controles Remotos Ltda. has met an impressive milestone in manufacturing having delivered its 10 millionth remote control.
Still celebrating the good success of their ongoing Indiegogo crowdfunding campaign for their iQi Mobile Wireless Charger For iPhone, Fonesalesman will has launch its Note 3 Wireless Charging System as well.
Further easing the development of processing-intensive applications, Texas Instruments (TI) is unveiling a new system-on-chip (SoC), the 66AK2H14, and evaluation module (EVM) for its KeyStoneTM-based 66AK2Hx family of SoCs. With the new 66AK2H14 device, developers designing high-performance compute systems now have access to a 10Gbps Ethernet switch-on-chip.
Tektronix, Inc., a leading worldwide provider of test, measurement and monitoring instrumentation, today announced that its AWG70000 Arbitrary Waveform Generator Series and its PA4000 Power Analyzer won EDN China's 2013 Innovation Award in the "Communication Test" and "General Test" categories of Test and Measurement.
XENON Corporation, the world leader in pulsed light technology, announced it will feature live demonstrations of the world’s first large scale R2R pulsed light sintering system at this year’s Printed Electron...
Semiconductors, the foundation of modern electronics used in flat-screen TVs and fighter jets, could become even more versatile as researchers make headway on a novel, inexpensive way to turn them into thin films. Their report on a new liquid that can quickly dissolve nine types of key semiconductors appears in the Journal of the American Chemical Society.
Today electronics 3D printer The EX¹ launches on crowd-funding site Kickstarter. Starting from $1,199 on an early bird special, The EX¹ is a rapid prototyper that makes printing electronics and circuit boards as quick and as easy as printing a photo.
The Consumer Electronics Association (CEA)® recently announced the winners of the sixth annual Technology & Standards Awards. Nominees were judged on their commitment to excellence as evidenced by the extent and consistency of their overall, ongoing contributions to CEA’s Technology & Standards program.
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