Leading semiconductor test equipment supplier Advantest Corporation has entered a new market segment by selling a V93000 Smart Scale™ platform to Avago Technologies' Fiber Optic Products Division (FOPD) for use in testing optical transceiver devices for high-speed backplane and telecommunication applications.
Dr. Jayant Baliga, a Distinguished University Professor of Electrical and Computer Engineering at North Carolina State University and founding director of the university’s Power Semiconductor Research Center, has received the Medal of Honor from the Institute of Electrical and Electronics Engineers (IEEE).
Fairchild Semiconductor, a leading global supplier of high performance power and mobile semiconductor solutions, introduces a series of 1200 V field stop trench IGBTs. Targeting hard-switching industrial applications such as solar inverters, uninterruptible power supplies (UPS), and welders, this new IGBT series will help power engineers achieve better efficiency and reliability in their designs.
Kyocera Corporation announced that the company’s unique “Kyoto Opal” material is being utilized in protective film screen covers for the iPhone 5s/5c/5. The covers, featuring sparkling characteristics similar to natural opal, recently went on sale in Tokyo and will also be available in the U.S. through the maker’s Web site starting December 5 (Power Support International: http://www.powersupportintl.com/iPhone-5-5c-5s-Film-s/1863.htm).
Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, today announced it has reached high-volume manufacturing of its new Enhanced Signal Integrity(TM) (eSI) substrates, enabling cost-effective and high-performance radio-frequency (RF) devices.
Point Grey, a world-leading designer and manufacturer of innovative, high-performance digital cameras, today announced the latest addition to its popular line of Blackfly GigE Vision cameras. The new Blackfly camera offers 5 megapixel resolution in an ultra-compact, low-cost package.
USHIO INC., (President and CEO: Shiro Sugata) today announced that the company installed one unit of a projection aligner dedicated to developing 2.5D glass substrate at the Georgia Tech 3D Systems Packaging Research Center (GT-PRC) on October 31 in 2013, based on conclusion of the partnership agreement related to the interposer development consortium sponsored by GT-PRC. USHIO has already dispatched its engineer and started supporting development of lower-cost glass interposers and packages.
Dow Corning, a global leader in silicones, silicon-based technology and innovation, today introduced new Dow Corning® Dispensable Thermal Pads, an advanced new technology developed for more cost-effective thermal management of high-performance electronics targeting LED lamp and luminaires, data servers, telecommunications equipment and transportation applications.
Reportlinker.com announces that a new market research report is available in its catalogue: Analysis of the Global Surface Mount Technology Inspection Equipment Market
Samsung Electronics, a global leader in innovation in consumer electronics and IT technology, announced the opening of its first Canadian R&D Centre in Vancouver, British Columbia. The exciting new venture will focus on developing Samsung's enterprise security solutions, while also providing global technical support for the company's diverse B2B customers.
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