Vishay Intertechnology, Inc. today announced that the company’s TP8 and T42 solid tantalum chip capacitors, T18 wet tantalum capacitors, and IHLP-2525CZ-8A low-profile, high-current inductor have been selected for Electronic Design’s “Top 101 Components.” The annual list compiles the 101 components from the previous year most popular among readers of the magazine’s Products of the Week newsletter.
Stratasys Ltd., a leading global provider of 3D printing and additive manufacturing solutions, today announced that British product design house, Ignitec, has designed and manufactured a new generation of wireless headphones for technology start-up and luxury goods company Audiowings, using its Stratasys Objet30 Pro 3D Printer.
Xilinx, Inc. today announced that it won 2014 EDN China Innovation Awards. The company was recognized with a Top 10 Most Influencial Technologies for the Future award for its All Programmable SoC technology and the Best Product award in the programmable devices category.
Vishay Intertechnology, Inc. today announced that it has extended its RCL e3 series of long side termination thick film chip resistors with new devices in the 0406 and 1225 case sizes. For automotive electronic circuits and general purpose applications, the RCL0406 e3 and RCL1225 e3 offer enhanced thermo cycling performance and provide increased power ratings to 0.25 W and 2.0 W, respectively.
SolidRun Ltd. continues to bring innovation to the electronics and computer world as they announce today the launch of their new and powerful credit card sized computer, the HummingBoard™. The HummingBoard was created as a small and powerful, low-cost ARM computer, and joins SolidRun's popular CuBox-i mini-computer family.
The newly merged SUNY College of Nanoscale Science and Engineering (CNSE) / SUNY Institute of Technology (SUNYIT) today announced that Associate Professor of Nanoengineering Dr. F. (Shadi) Shahedipour-Sandvik has been named Editor-in-Chief of the Journal of Electronic Materials.
Alpha and Omega Semiconductor Limited (AOS), a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today announced the release of the AOZ1334, a single-channel EZPower™ Smart Load Switch.
About 1500 European companies, research institutes and Universities got together in consortia and submitted Expressions of Interest indicating their readiness to propose in 2014 at least 74 R&D projects with a total of 2.9 Billion euro eligible costs to be funded through the new ECSEL Joint Undertaking (JU).
Applied Materials, Inc. today announced the Applied Varian VIISta® 900 3D system, the industry's state-of-the-art medium-current ion implantation tool developed for manufacturing FinFET and 3D NAND designs at sub-2x nanometer nodes.
Today, Dr. Kenan Sahin, founder and interim president of CAMX Power, announced the release of the Company's breakthrough lithium-ion cathode material CAM-7.2™ for use in advanced batteries.
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