Veeco Instruments, a manufacturer of process equipment for developing and producing hard disk drives, solar cells, LEDs and other devices, has announced the selection of its gallium nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) System called TurboDisc K465i by Epistar for growing light emitting diodes (LEDs) on silicon substrates.
Rudolph Technologies has entered into a new market for metrology by delivering its first MetaPULSE metrology system for measuring redistribution layers (RDL) and under bump metallization (UBM) utilized in sophisticated back-end packaging technologies of the integrated circuit (IC) production process.
LG Siltron, an epi wafer manufacturer based in South Korea, has chosen Veeco Instruments’ gallium nitride metal organic chemical vapor deposition (MOCVD) system called TurboDisc K465i for manufacturing gallium nitride on silicon (GaN-on-Si) wafers for use in LED devices and power electronics.
Cadence, a global innovator of electronic design products and Samsung Foundry, the foundry business of Samsung Electronics have collaborated to develop design-for-manufacturing (DFM) infrastructure for production of advanced chips.
Qcept Technologies, a company specializing in wafer inspection solutions, has declared its participation in several major key nanotechnology conferences to be conducted during Q1 of 2012.
Tanaka Kikinzoku Kogyo, a Tanaka Precious Metals’ company, had succeeded in developing a ruthenium material that can be utilized to form a film with the normal depth up to six times for capacitor electrodes utilized in DRAM (Dynamic Random Access Memory), a semiconductor memory.
Chris Van de Walle, professor of Materials, has been promoted to IEEE Fellow for contributions to the theory of interfaces, doping and defects in semiconductors.
QD Vision, a company developing optical products for solid state lighting and displays using nanotechnology, has been felicitated with the 2011 SEMI Award for North America for its efforts in the integration and production processes towards the commercialization of quantum dot technology.
Mitsubishi Heavy Industries Ltd (MHI) has developed the world's first fully automated 12-inch (300 millimeters) wafer bonding machine, dubbed the "Bond Meister MWB-12-ST," capable of producing 3-dimensional...
STATS ChipPAC, a provider of semiconductor advanced packaging and test solutions, has conducted the groundbreaking ceremony for its new plant to be built close to its existing facility in Yishun, Singapore, to expand its production capabilities for sophisticated wafer level technologies such as through silicon via (TSV), integrated passive devices (IPD), wafer level chip scale packaging (WLCSP) and embedded wafer level ball grid array (eWLB).
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