Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will share his expertise at the International Union of Materials Research Societies – International Conference on Electronic Materials (IUMRS-ICEM) from June 10-14 at Taipei World Trade Center Nangang Exhibition Hall in Taipei, Taiwan.
Leading semiconductor test equipment supplier Advantest Corporation has released its new EVA100 measurement system, an evolutionary value-added platform that combines digital and analog testing capabilities to handle small-pin-count analog, mixed-signal and sensor semiconductors.
Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, and Shanghai Simgui Technology Co., Ltd. (Simgui), a Chinese silicon-based semiconductor materials company, have formed an international partnership to address both China's growing demand and limited worldwide production capacity for 200-mm silicon-on-insulator (SOI) wafers used in fabricating semiconductors for radio-frequency (RF) and power applications.
Global electronic components distributor Digi-Key Corporation, the industry leader in electronic component selection, availability and delivery, recently signed a global distribution agreement with Akros Silicon, a provider of leading-edge power management ICs. Akros’ solutions help manufacturers of electronic equipment create more efficient and advanced products at reduced costs, while enabling end users the ability to reduce energy usage.
Vishay Intertechnology, Inc. today announced its technology lineup for the 2014 IEEE MTT International Microwave Symposium (IMS2014), being held from June 1-6 at the Tampa Convention Center in Tampa Bay, Florida. At the conference and exhibition, the company will be highlighting its latest industry-leading multilayer ceramic chip capacitors (MLCCs) and surface-mount and wire-bondable thin film products.
Indium Corporation’s Derrick Herron, technical support engineer, will serve as an expert presenter at ZESTRON’s Assembly, Cleaning, and Reliability Hands-on Workshop on June 10 in Franklin, Mass.
ON Semiconductor, driving energy efficient innovations, has introduced a new family of six N-channel Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) that have been designed and optimized to deliver industry leading efficiency compared to existing devices on the market.
Global Communication Semiconductors, LLC (GCS), a pure-play III-V compound semiconductor wafer foundry, announced today that its proprietary P3 InGaP HBT will now be offered to address the 802.11ac requirements in which high gain, high linearity, and high efficiency are the key requirements at 5 GHz operation; In addition, GCS announced the offering of the 0.25um Enhancement mode (E-mode) Low noise pHEMT process for high performance receiver applications, with useful frequencies of up to 26 GHz.
Indium Corporation and Kyzen hosted a technical seminar on April 29 in Hsinchu, Taiwan.
In the past, high voltage (HV) discrete device and product development consisted of a long, serial approach where technologies were developed in TCAD*, physical parts fabricated and packaged, measurements performed and an iterative calibration cycle launched.
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