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Amkor Honors SUSS MicroTec with ‘2013 Best of Class Equipment Award’

SÜSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, was honored with the '2013 Best of Class Equipment Award' from Amkor Technology on October 18, 2013. Every year the most successful suppliers of Amkor receive this award. SÜSS MicroTec was especially honored for its lithography equipment and process solutions for the semiconductor mid- and backend.

From Focuslight Technologies Inc. 5 Nov 2013

Si2 Sponsors ‘3D Architectures for Semiconductor Integration and Packaging Conference 2013’ at Burlingame

Silicon Integration Initiative (Si2) announced today its sponsorship of the 3D Architectures for Semiconductor Integration and Packaging Conference (3D ASIP). This conference will be held December 11-13, 2013, at the Hyatt Regency San Francisco Airport, Burlingame, California, and is organized by RTI International.

31 Oct 2013

NANIUM Improves Embedded Wafer-Level Ball Grid Array Fan-Out Wafer-Level Packaging Technology

NANIUM S.A., Europe’s largest outsourced semiconductor assembly and test (OSAT) service provider, today announced the introduction of an improved dielectric material and process solution for its fan-out wafer-level packaging (FOWLP) technology, embedded wafer-level ball grid array (eWLB). These improvements increase eWLB’s reliability, thereby extending the existing technology platform into more demanding markets and applications including medical devices, aerospace and automotive, among others.

31 Oct 2013

Customizable Large Diameter Patterned Sapphire Substrates for LED Industry Launched by Rubicon Technology

Rubicon Technology, Inc., a leading provider of sapphire substrates and products to the LED, semiconductor, and optical markets, today announced the launch of the first commercial line of large diameter patterned sapphire substrates (PSS) in four-inch through eight-inch diameters. This new product line provides LED chip manufacturers with a ready-made source of large diameter PSS to serve the needs of the rapidly growing LED general lighting industry.

30 Oct 2013

Triton’s Production Milestones Trigger Additional Funding for Developing TGV Interposer Manufacturing Facility

Start-up Triton Microtechnologies, a designer and manufacturer of ultra-thin glass interposers that enable advanced semiconductor-packaging solutions, has met six-month production milestones that have triggered an additional $3.2 million in funding from parent companies Asahi Glass Co., Ltd. (AGC) of Tokyo and nMode Solutions Inc. in Oro Valley, Arizona.

29 Oct 2013

Freescale Semiconductor Receives Synopsys' Tenzing Norgay Interoperability Achievement Award

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, announced that Freescale® Semiconductor will receive Synopsys' thirteenth annual Tenzing Norgay Interoperability Achievement Award for advancing industry standards that enable interoperable system design flows.

24 Oct 2013

SRC Announces SSB Research Program on Hybrid Bio-Semiconductor Systems

Semiconductor Research Corporation (SRC), the world’s leading university-research consortium for semiconductor technologies, today launched the Semiconductor Synthetic Biology (SSB) research program on hybrid bio-semiconductor systems to provide insights and opportunities for future information and communication technologies.

24 Oct 2013

Silvaco's Simulation Environment for Organic Semiconductor Device Design Adopted by PI-CRYSTAL

Silvaco Japan Co., Ltd has announced that PI-CRYSTAL Incorporation (PI-CRYSTAL) has adopted Silvaco's simulation environment, the design of organic semiconductor devices.

23 Oct 2013

Axcelis Receives Supply Order for Purion XE Single Wafer, High Energy Implanter

Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced that it has received a multiple system order for the Company's new Purion XE single wafer, high energy implanter.

23 Oct 2013

Vishay Introduces DLA-Approved Tantalum-Cased Wet Tantalum Capacitor with Glass-to-Tantalum Hermetic Seal

Vishay Intertechnology, Inc. today introduced a new tantalum-cased wet tantalum capacitor with a glass-to-tantalum hermetic seal that is approved to Defense Logistics Agency (DLA) drawing 13017.

18 Oct 2013

Editorial Highlights

The Current State of the Global Semiconductor Market

The global semiconductor market has entered an exciting period. Demand for chip technology is both driving the industry as well as hindering it, with current chip shortages predicted to last for some time. Current trends will likely shape the future of the industry, which is set to continue to show

How are Graphene Batteries Made?

The primary distinction between graphene-based batteries and solid-state batteries lies in the composition of either electrode. Although the cathode is commonly changed, carbon allotropes can also be employed in fabricating anodes.

What Role Will The IoT Play In The Electric Vehicle Industry?

In recent years, the IoT is rapidly being introduced into almost all sectors, but it has particular importance in the EV industry.

Semiconductor News

Amkor Honors SUSS MicroTec with ‘2013 Best of Class Equipment Award’

Si2 Sponsors ‘3D Architectures for Semiconductor Integration and Packaging Conference 2013’ at Burlingame

NANIUM Improves Embedded Wafer-Level Ball Grid Array Fan-Out Wafer-Level Packaging Technology

Customizable Large Diameter Patterned Sapphire Substrates for LED Industry Launched by Rubicon Technology

Triton’s Production Milestones Trigger Additional Funding for Developing TGV Interposer Manufacturing Facility

Freescale Semiconductor Receives Synopsys' Tenzing Norgay Interoperability Achievement Award

SRC Announces SSB Research Program on Hybrid Bio-Semiconductor Systems

Silvaco's Simulation Environment for Organic Semiconductor Device Design Adopted by PI-CRYSTAL

Axcelis Receives Supply Order for Purion XE Single Wafer, High Energy Implanter

Vishay Introduces DLA-Approved Tantalum-Cased Wet Tantalum Capacitor with Glass-to-Tantalum Hermetic Seal

The Evolution and Versatility of Benchtop XRD

A New Approach to Flash Point Testing

How to Use AFM to Study 2D Materials and Superlattices

Benchtop micro-XRF System for the Elemental Analysis of Samples

Advanced Masterbatch and Compounding for Polymers and Plastics

AirBreather Platform for Continuous Gas Analysis

Sponsored Content

How is Biotechnology Applied in the Plastics Sector?

A Guide to ASTM D790 and its Importance

Introduction to Polymer Analysis Using Near-Infrared and Raman Spectroscopy

Ethylene Oxide Regulations: How Changes Might Play Out Under New Administration

Editorial Highlights

The Current State of the Global Semiconductor Market

How are Graphene Batteries Made?

What Role Will The IoT Play In The Electric Vehicle Industry?

Semiconductor News

The Evolution and Versatility of Benchtop XRD

A New Approach to Flash Point Testing

How to Use AFM to Study 2D Materials and Superlattices

1Halogen-Free Polymer Electrolytes: A Sustainable Energy Solution

2Researchers Develop AI Framework for Optimizing Battery Electrolytes

3Smart Coatings: Thermally Responsive Polymer Brushes for Advanced Applications

4Upcycling LDPE: Transforming Plastic Waste into High-Value Graphite

5Green Steel: How Hydrogen and Electric Ironmaking Drive Innovation

6Sustainable Energy Harvesting: Turning Plastic Waste into Power

Sponsored Content

Editorial Highlights