TowerJazz, the global specialty foundry leader, today announced it will participate at the Electronic Design and Solution (EDS) Fair in Yokohoma, Japan on November 20-22, 2013 to further its relationships with its EDA partners in Japan and gain more exposure with Japanese fabless companies and IDMs for the local availability of its pure play foundry offerings and design enablement innovation. TowerJazz has participated at EDSFair for the past two years since its acquisition of the Micron fab in Nishiwaki, Japan.
Leading semiconductor test equipment supplier Advantest Corporation's U.S. subsidiary Advantest America, Inc. has earned a spot on the U.S. Environmental Protection Agency's (EPA) Top 30 Tech and Telecom list. This is the first time that Advantest America has been ranked on EPA's quarterly list, which represents the 30 largest green power users among technology and telecommunications companies within the Green Power Partnership.
Although silicon semiconductors are nearly universal in modern electronics, devices made from silicon have limitations—including that they cease to function properly at very high temperatures. One promising alternative are semiconductors made from combinations of aluminum, gallium, and indium with nitrogen to form aluminum nitride (AlN), gallium nitride (GaN), and indium nitride (InN), which are stronger and more stable than their silicon counterparts, function at high temperatures, are piezoelectric (that is, generate voltage under mechanical force), and are transparent to, and can emit, visible light.
The Silicon Integration Initiative (Si2) announced today their OpenPDK Coalition has released the Open Process Specification v1.1. The Open Process Specification (OPS), from Si2’s OpenPDK Coalition, contains all of the data elements that are necessary to automatically create a Process Design Kit (PDK) in any EDA vendor’s or company proprietary design flow.
SÜSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, was honored with the '2013 Best of Class Equipment Award' from Amkor Technology on October 18, 2013. Every year the most successful suppliers of Amkor receive this award. SÜSS MicroTec was especially honored for its lithography equipment and process solutions for the semiconductor mid- and backend.
Silicon Integration Initiative (Si2) announced today its sponsorship of the 3D Architectures for Semiconductor Integration and Packaging Conference (3D ASIP). This conference will be held December 11-13, 2013, at the Hyatt Regency San Francisco Airport, Burlingame, California, and is organized by RTI International.
NANIUM S.A., Europe’s largest outsourced semiconductor assembly and test (OSAT) service provider, today announced the introduction of an improved dielectric material and process solution for its fan-out wafer-level packaging (FOWLP) technology, embedded wafer-level ball grid array (eWLB). These improvements increase eWLB’s reliability, thereby extending the existing technology platform into more demanding markets and applications including medical devices, aerospace and automotive, among others.
Rubicon Technology, Inc., a leading provider of sapphire substrates and products to the LED, semiconductor, and optical markets, today announced the launch of the first commercial line of large diameter patterned sapphire substrates (PSS) in four-inch through eight-inch diameters. This new product line provides LED chip manufacturers with a ready-made source of large diameter PSS to serve the needs of the rapidly growing LED general lighting industry.
Start-up Triton Microtechnologies, a designer and manufacturer of ultra-thin glass interposers that enable advanced semiconductor-packaging solutions, has met six-month production milestones that have triggered an additional $3.2 million in funding from parent companies Asahi Glass Co., Ltd. (AGC) of Tokyo and nMode Solutions Inc. in Oro Valley, Arizona.
Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, announced that Freescale® Semiconductor will receive Synopsys' thirteenth annual Tenzing Norgay Interoperability Achievement Award for advancing industry standards that enable interoperable system design flows.
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