Micron Technology, Inc. and LFoundry today announced that the companies have entered into agreements for LFoundry to acquire Micron Technology Italia, Srl. and all of its semiconductor fabrication facility assets in Avezzano, Italy.
GeneSiC Semiconductor, a pioneer and global supplier of a broad range of Silicon Carbide (SiC) power semiconductors today announces the immediate availability of a family of 1700V and 1200 V SiC Junction Transistors.
Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, and Sumitomo Electric Industries, Ltd., a leading worldwide provider of compound semiconductor materials, have signed a licensing and technology-transfer agreement under which Sumitomo Electric will use Soitec's proprietary Smart Cut™ technology to manufacture engineered gallium nitride (GaN) substrates.
SEMATECH today announced that Poongsan, a leading producer of annealing furnaces, has joined its Front End Processes (FEP) program, and will work with SEMATECH to explore high-pressure anneal (HPA) techniques for silicon and non-silicon channel materials to improve device performance and reliability for next-generation technologies.
Mentor Graphics Corporation today announced that NXP Semiconductors has become part of the Mentor® Embedded Nucleus® Innovate Program. Participants in the Nucleus Innovate program now have access to board support packages for NXP Semiconductor microcontroller devices.
Alpha and Omega Semiconductor Limited (AOS), a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today introduced the AOTF11C60 and AOTF20C60, 600V MOSFETs with AlphaMOS™ II technology.
SEMATECH today announced that Cabot Microelectronics Corporation, the world’s leading supplier of chemical mechanical planarization (CMP) polishing slurries and a growing CMP pad supplier to the semiconductor industry, has joined its Front End Processes (FEP) program and will collaborate with SEMATECH to develop advanced solutions for emerging CMP applications.
Mitsubishi Electric Corporation announced today it has developed a prototype multi-wire electrical discharge processing technology to cut very hard 4 inch square polycrystalline silicon carbide (SiC) ingots into 40 pieces at once. The technology is expected to improve both the productivity of SiC slicing and the effective use of SiC material. Mitsubishi Electric aims to market its multi-wire electrical discharge slicer by fiscal 2015.
eSilicon Corporation, the largest independent semiconductor design and manufacturing services provider, today announced that An ASIC Low-Power Primer is now available from Springer, a leading publisher of science and technology reference books. Written by eSilicon engineers Dr. J. Bhasker, architect, and Dr. Rakesh Chadha, director of design technology, the book provides an invaluable primer on the techniques utilized in the design of low-power digital semiconductor devices.
Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, has estimated that its engineered substrates used in manufacturing semiconductors for mobile communications are incorporated in at least 50 percent of smart phones and internet-connected tablet computers being produced today.
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