STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a leading producer of ICs for cable set-top boxes and home gateways, has revealed the first three chips in its new family supporting the DOCSIS 3.0 cable-modem specification.
Almost all computer chips use two types of transistors: one called p-type, for positive, and one called n-type, for negative. Improving the performance of the chip as a whole requires parallel improvements in both types.
Cypress Semiconductor Corp. today announced that the International Trade Commission (ITC) has agreed to review the entire Initial Determination issued by Chief Administrative Law Judge Charles E. Bullock in the pending patent case between Cypress and GSI Technology. Cypress has asserted that GSI SRAMs infringe multiple Cypress patents.
Semiconductor revenues worldwide will see nominal growth this year at less than 1% reaching $304 billion according to the year-end 2012 update of the International Data Corporation (IDC) Semiconductor Applications Forecaster (SAF). The SAF also forecasts that semiconductor revenues will improve by 4.9% to $319 billion in 2013 and log a compound annual growth rate (CAGR) of 4.1% from 2011-2016, reaching $368 billion in 2016.
Diodes Incorporated, a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, and BCD Semiconductor Manufacturing Limited ("BCD Semiconductor" or "BCD") (Nasdaq: BCDS), a leading analog integrated device manufacturer incorporated in the Cayman Islands, today announced that Diodes has entered into an Agreement and Plan of Merger to acquire BCD.
TSMC has been honored as this year's recipient of the Cisco 2012 Silicon EcoSystem Excellence Award.
CSR plc, today announced that it has been named “Outstanding EMEA Semiconductor Company” by the Global Semiconductor Alliance (GSA). The GSA is a non-profit semiconductor organisation, founded in 1994, to be the voice of the global semiconductor industry.
Rubicon Technology, Inc., a leading provider of sapphire substrates and products to the LED, semiconductor, and optical industries, today announced that the United States Patent and Trademark Office (USPTO) has allowed Rubicon’s patent application entitled, “Ultra-Flat, High-Throughput Wafer Lapping Process.”
Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, is proud to present a paper during the European 3D TSV Summit (Grenoble - Jan 22-23, 2013).
Brooks Instrument, a world-leading provider of advanced flow, pressure, vacuum and level solutions, has received International Electrotechnical Commission (IECEx) certification for its SolidSense II pressure transducers.
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