The National Institute of Standards and Technology (NIST) will contribute to the funding of a joint venture put forward by Molecular Imprints. The joint venture will develop nano-imprint lithography at key semiconductor roadmap nodes.
Other joint venture partners include KLA-Tencor, Photronics, Motorola Labs and The University of Texas at Austin. They along with Molecular Imprints will contribute $19.1 million in cost sharing, with NIST throwing in further $17.6 million.
The projects objective is to establish the necessary technology infrastructure associated with the step and flash imprint lithography (S-FIL™) process, including system, materials, and template (mask) development. The three-year project will focus on dense contact layers, which are critical in silicon integrated circuit fabrication.
The technology will address the demanding silicon CMOS lithography requirements.
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