Molecular Imprints Leads $36m Joint Venture To Develop S-FIL Technology

The National Institute of Standards and Technology (NIST) will contribute to the funding of a joint venture put forward by Molecular Imprints. The joint venture will develop nano-imprint lithography at key semiconductor roadmap nodes.

Other joint venture partners include KLA-Tencor, Photronics, Motorola Labs and The University of Texas at Austin. They along with Molecular Imprints will contribute $19.1 million in cost sharing, with NIST throwing in further $17.6 million.

The projects objective is to establish the necessary technology infrastructure associated with the step and flash imprint lithography (S-FIL™) process, including system, materials, and template (mask) development. The three-year project will focus on dense contact layers, which are critical in silicon integrated circuit fabrication.

The technology will address the demanding silicon CMOS lithography requirements.

For more information on semiconductors, click here.

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