Jul 30 2014
eSurface® Technologies, the developer of the eSurface proprietary process for printed circuit boards, today announced it has been granted two patents by the United States Patent and Trademark Office.
The eSurface® Technologies patented process significantly increases the ability to manufacture printed circuit boards with ultra-fine capabilities < 1/1 L/S, through selective metallization and controlled fine feature build-up, dramatically improving production yields for printed circuit board manufacturers. (Photo: Business Wire)
The granted patents, #’s 8,784,952 and 8,784,953 respectively, cover the areas of surface activation and metallization. The patents relate to the proprietary method for the metallization of a non-conductive surface.
The eSurface Proprietary Process:
The eSurface patented process is available to license for the manufacture of printed circuit boards and other electronic components. The patented technology allows for significant process cost savings vs. current manufacturing technology, almost completely eliminating the toxic waste generated by conventional manufacturing methods, and allows conductive material to be embedded in virtually any surface that can receive an image. While the primary addressable market of eSurface Technologies is circuit fabrication, the non-circuit applications are significant when the bonding of a metal in a surface is required or advantageous.
“Securing patent rights on such a critical market advancement places eSurface Technologies in an exceptional market position,” stated David Martin, Ph.D., eSurface Technologies Advisory Board Member and founding CEO of M•CAM™. “The introduction of these pioneering patents will affect a multitude of industries and business sectors. However, with the initial commercial industry launch within the electronics business sector, eSurface is making a tremendous impact. As the world increasingly depends on printed circuit board technology, eSurface Technologies’ patented innovation represents a radical step forward in manufacturing versatility, device functionality, and product innovation. While there’s been a proliferation of production process efficiency, miniaturization, and substrate improvements in the industry, these patent claims and the underlying technology represent a paradigm shift in the science of PCB form and function which will be indispensable to the success of licensed manufacturers’ products.”
“We are pleased with the recent grants of these two patent applications and look forward to many others as our company continues to mature and grow into a leader within the technology sector,” stated Dr. William Wismann, D.Sc. TECH, eSurface Executive Vice President and Chief Technology Officer. “Receiving a patent encompassing your core technology is validation you are taking an approach unique to the market.”
“We are fortunate to have Dr. William Wismann, as part of our leadership team, whose talent and insight to resolve such key industry issues has resulted in this game changer,” stated Dave Benson, eSurface Technologies, President. “This milestone is also a tribute to the diligence and tenacity of Dr. Wismann’s technical team and our dedicated and talented management team from which we continue to grow our intellectual property portfolio and shareholder value. This is where we want to be as a company – solving technological challenges that others have not.”
About eSurface Technologies:
eSurface® Technologies is the creator of the eSurface process, a proprietary patented process that can dramatically impact the manufacturing and design segment of multiple industries. The initial adoption of the eSurface proprietary process by the global circuit board manufacturing industry is leading to the innovation of products previously not thought possible. The disruptive nature of the technology allows for new possibilities across almost all manufacturing markets. The company is currently looking into entering the wearable electronics, automotive, solar and space product manufacturing sectors. eSurface Technologies (DBA of EarthOne Circuit Technologies Corporation, a privately-held corporation) is based in Carlsbad, California.
About M•CAM International:
M•CAM International is the global leader in intellectual property based financial risk management. M•CAM has forged a globally unique business model that aligns innovation with ethical value exchanges. This means that banks can actually use intangible assets as regulatory capital qualified collateral reducing the cost of finance, clearing the way for companies to use intangible assets as financeable assets in credit and commercial markets.
©2014 eSurface Technologies. All rights reserved. eSurface, the eSurface logo and eSurface Covaler are trademarks of EarthOne Circuit Technologies Corporation. Other company and product names may be trademarks of their respective owners.
Source: http://www.esurface.com/