Ultimaker, the global leader in desktop 3D printing, today at Hannover Messe announced that the Ultimaker Material Alliance Program has now influenced over 80 companies worldwide to develop material print profiles for FFF 3D printing. Ultimaker first formed the program in April 2018 to meet the growing demand for industrial-grade engineering 3D printing materials.
Exactly one year after initiating the Ultimaker Material Alliance Program, a large group of leading material manufacturers, including BASF, DSM, DuPont, Owens Corning, Arkema, Jabil, Lehmann&Voss&Co. and many other filament producers, actively use the Print Profile Assistant provided by Ultimaker to more rapidly bring a wide variety of high performance FFF 3D printing materials to the professional market. These material print profiles become available for download in the Marketplace in Ultimaker Cloud.
Material choice is one of the key considerations for an engineer when it comes to choosing a manufacturing method. The open material strategy from Ultimaker makes it possible to print applications with different materials with specific properties such as heat, impact and chemical resistance, flexibility, strength and more.
“We’ve seen an overwhelming amount of interest in the Ultimaker Material Alliance Program since it's launch. In just twelve short months, we’ve worked with many global companies to unlock new applications and have produced some amazing results,” said Paul Heiden, Senior Vice President of Product Management at Ultimaker. “Professional users can now, for instance, select to print using a filament that is filled with metal to produce the same aesthetic effect as a more expensive metal system. As another outcome of the program, users can now select a material that is electrostatic discharge (ESD) safe, which allows engineers and designers in the electronics industry to fully benefit from desktop 3D printing.”
Visitors attending Hannover Messe can visit Ultimaker in Hall 6, booth K06 to learn more about the Ultimaker Material Alliance Program.