Posted in | News | Business | Events

YINCAE Advanced Materials to Exhibit and Present at IMAPS 2019 Boston 52nd International Symposium on Microelectronics

YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS 2019 Boston 52nd International Symposium on Microelectronics, at the Hynes Convention Center, in Boston, MA on October 1 - 2, 2019.

The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.

YINCAE offers a variety of exclusive materials such as thermal interface and wafer-level /packaging level/board level materials, die attach adhesives and underfill that have been adopted by leading contract manufacturers and tier 1 microelectronic customers, and we are excited to be showcasing some or our most popular products at iMAPS 52nd International Symposium on Microelectronics. YINCAE innovated the world’s first lead-free solder joint encapsulation adhesive solution for wafer level, flip chip, POP, LGA, BGA and many other applications. YINCAE offers SJEA for low, medium and high temperature solder alloy applications for your unique applications. YINCAE underfills not only offer high thermal conductivity and high Tg ( 245 °C) but also can be used at over 400 °C.

To schedule a meeting with the YINCAE team during the Symposium, please email us at: [email protected] with a brief description of the meeting topic. You can also find more information about our products by visiting our website at: www.yincae.com

We are looking forward to seeing you at this symposium! We produce cutting-edge products that are unique to the semiconductor industry. We will be available at our booth to talk about our products and answer any questions you may have. For more information or if you have any questions, please feel free to visit our website at: www.yincae.com or give us a call at 518-452-2880. We look forward to seeing you there.

Source: http://www.yincae.com/

Citations

Please use one of the following formats to cite this article in your essay, paper or report:

  • APA

    YINCAE Advanced Materials. (2019, August 02). YINCAE Advanced Materials to Exhibit and Present at IMAPS 2019 Boston 52nd International Symposium on Microelectronics. AZoM. Retrieved on December 09, 2022 from https://www.azom.com/news.aspx?newsID=51819.

  • MLA

    YINCAE Advanced Materials. "YINCAE Advanced Materials to Exhibit and Present at IMAPS 2019 Boston 52nd International Symposium on Microelectronics". AZoM. 09 December 2022. <https://www.azom.com/news.aspx?newsID=51819>.

  • Chicago

    YINCAE Advanced Materials. "YINCAE Advanced Materials to Exhibit and Present at IMAPS 2019 Boston 52nd International Symposium on Microelectronics". AZoM. https://www.azom.com/news.aspx?newsID=51819. (accessed December 09, 2022).

  • Harvard

    YINCAE Advanced Materials. 2019. YINCAE Advanced Materials to Exhibit and Present at IMAPS 2019 Boston 52nd International Symposium on Microelectronics. AZoM, viewed 09 December 2022, https://www.azom.com/news.aspx?newsID=51819.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type
Submit