During material manufacture, residual stress may be created or may be accumulated in a structure over many years in operation. Either way, this stress may negatively impact the quality, durability and lifetime of a product.
The AUTOMATE II Micro-Area X-ray Residual Stress Measurement System enables measurement of large and heavy parts (30kg with standard manual Z stage; 20kg with optional automated XYZ stage) with very high accuracy. This is possible as the detector arm and the X-ray source are mounted on a highly accurate two-axis goniometer that can position them relative to the measurement site and perform scans with an accuracy of 0.1µm when using the automated XYZ stage.
A highly advanced feature of the AutoMATE II lies in an innovative new X-ray detector. The detector used in the AutoMATE II is the D/teX Ultra1000, an electronic Si strip detector that has high dynamic range, high sensitivity, and good energy resolution, as well as does not require any consumable gas.
The key features of the AutoMATE II are:
- Highly accurate goniometer allows for true micro-area residual stress measurement.
- Automatic mapping measurements with teaching function.
- Large and heavy samples are measured with high accuracy.
- An X-ray radiation enclosure with interlock system automatically locks the enclosure door when the X-ray shutter is open.
- The measurement position is adjusted by a CCD camera equipped with a microscope having a zoom function.
- The two-axis goniometer system allows for both iso-inclination and side-inclination methods automatically without readjustment of the sample position.