Nordson MARCH has launched the new FasTRAK Plasma System, which is a high-throughput, fully-automated, vacuum plasma treatment system developed for laminate substrates, lead-frame strips, and other strip-type microelectronic components.
By G.P. Thomas
10 Jul 2012
Westinghouse Electric, a nuclear energy company and a supplier of nuclear plant products and technologies to utilities across the world, has partnered with Vitkovice, a Czech engineering company, to construct and install modules for the new nuclear power plants at the Temelin site in the Czech Republic.
By Nick Gilbert
10 Jul 2012
Juki Automation Systems (JAS), a company specializing in high-speed SMT assembly equipment, recently received an order for six modular assembly systems, two KE-2080 Mounters and four KE-2070 High-Speed Flexible Mounters from PRIDE Industries, a nonprofit organization and recognized service supplier.
By Nick Gilbert
10 Jul 2012
Applied Materials, a provider of innovative equipment, services and software to enable the production of advanced semiconductor, flat panel display and solar photovoltaic products, has introduced Applied UVision 5 wafer inspection system to monitor the defects in sub-20 nm critical patterning layers of logic devices.
Imec has announced that it is exhibiting a 20.04% large-area industrial-level silicon solar cell at the Intersolar Show, which is being held from 9 to 12 July, 2012 in San Francisco. This high-efficient solar cell is manufactured using a low-cost industrial method.
Intertronics provides quality adhesive solutions for high performance, high technology assembly industries. The company develops products to address the constantly-varying demands of the industry.
WALLTITE Eco polyurethane foam insulation or air barrier system from BASF was recognized at the second yearly Concours Écoconception 2012, an event that honors new and sustainable programs in Quebec. This event was conducted at l’eXcentris Cinema Theatre located in Montreal, Quebec.
STATS ChipPAC, a major provider of semiconductor packaging test, design, assembly and distribution solutions, has reported that its cutting-edge flip chip packaging technology called fcCuBE technology featuring improved assembly processes, bond-on-lead interconnection and copper column bumps is under large-scale production for numerous customers.
By Nick Gilbert
10 Jul 2012
Research and Markets has reported the inclusion of a new report titled ‘Global Packaging Survey 2012-2013: Market Trends, Buyer Spend and Procurement Strategies in the Global Packaging Industry’ to its catalogue.
By Nick Gilbert
10 Jul 2012
As demonstrated at the recent European Society for Precision Engineering and Nanotechnology (EUSPEN) 12th International Conference and Exhibition in Sweden, Olympus continues to provide expertise to the material science community.
The Pittcon Exposition Committee is now accepting booth space reservations for Pittcon 2013, which will be held March 17-21, at the Pennsylvania Convention Center in Philadelphia, PA.
Frost & Sullivan reports a huge growth potential for thin film batteries. It estimates the market to grow to $1,986.5 million in 2018 from $86.7 million in 2011. Thin film batteries are suitable for ultra-thin devices.
By Dr. Cameron Chai
9 Jul 2012
During the opening ceremony of the European Society of Glass Science and Technology conference conducted on June 4, 2012, in Maastricht, Corning’s Dr John C. Mauro has earned the first SGT – Alastair Pilkington Early Career Award for his work on the development and expansion of computer simulation applications in many facets of glass science.
By G.P. Thomas
9 Jul 2012
Teijin has declared that Teijin CNF Korea has commenced the manufacturing of LIELSORT, a new separator for use in lithium ion secondary batteries (LIBs). Teijin CNF Korea is an Asan-based joint venture established between CNF, a main film processor in Korea, and Teijin. LIELSORT was developed by Teijin.
TDK has reported that it has developed a wireless power transfer coil unit specifically designed for use in smartphones and other mobile devices. The receiving coil can be integrated into smartphones. It has a width of just 0.57 mm.
By Nick Gilbert
9 Jul 2012