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Photodoping in 2D Materials for Fabrication of Logic Devices

NUS scientists have discovered a method for photoinduced electron doping on molybdenum ditelluride (MoTe2) heterostructures for fabricating next generation logic devices.

7 May 2019

Advantest Introduces New V93000 Wave Scale Millimeter Solution to Cost-Effectively Test 5G-NR mmWave Devices up to 70 GHz

Leading semiconductor test equipment supplier Advantest Corporation has extended its V93000 system to cost-efficiently test the next generation of 5G-NR radio frequency devices and modules on a single scalable platform.

From Advantest Corporation 7 May 2019

Smart Manufacturing, IoT, and Workforce Development Take Spotlight at SEMICON Southeast Asia 2019

Poised to draw an event record of more than 9,000 visitors, SEMICON Southeast Asia (SEA) 2019 opens today with global electronics manufacturing pillars Smart Manufacturing, Internet of Things (IoT) and Workforce Development in the spotlight.

7 May 2019

State-of-the-Art Verification Now as Online Training and Live at SMTconnect

Viscom AG has launched an online course on operating the vVerify verification station. The new learning tool is accessible exclusively to Viscom customers. Visitors of the SMTconnect trade show can see live for themselves how easy it is to classify analytical results with vVerify.

From Viscom AG 7 May 2019

ASMC 2019 Highlights Latest Advanced Manufacturing Strategies

Celebrating its 30th anniversary, the SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2019) kicks off today with more than 300 industry experts and executives delivering more than 30 hours of technical presentations on the latest advanced manufacturing strategies and methodologies.

7 May 2019

iwis VP8 FoodPlus Spray

Following the proven success of its VP6 Kombi Superplus Spray for industrial chain applications, drive systems supplier iwis antriebssysteme GmbH & Co. KG has launched another innovative product: VP8 FoodPlus Spray.

From iwis 7 May 2019

Husky Launches Next Generation Molding Solution for Better Energy Savings

Husky Injection Molding Systems has announced the launch of its next generation HyPET™ HPP5e system.

From Husky Injection Molding Systems Ltd 6 May 2019

UPM Develops Large Scale Robot-based 3D Printing Applications Using PLA Biocomposite

In collaboration with ABB and Prenta, UPM has demonstrated large scale robot-based granulate 3D printing applications with UPM Formi 3D biocomposite opening new possibilities for designers and manufacturers.

From UPM 6 May 2019

BTU Delivers 5th PYRAMAX Reflow Oven to TKT Electronics in Denmark

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce that TKT Electronics has installed its fifth PYRAMAX™ reflow oven.

From BTU International 6 May 2019

MODI and VisiConsult Present New Product Cooperation at SMTconnect in Nuremberg

Over the past few months, MODI and VisiConsult have been working together to come up with a solution for their customers: fully automatic text recognition for databases and test counting of parts in one. The result will be presented for the first time at SMTconnect expo in Nuremberg.

From MODI Modular Digits GmbH 6 May 2019