STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a leading producer of ICs for cable set-top boxes and home gateways, has revealed the first three chips in its new family supporting the DOCSIS 3.0 cable-modem specification.
Integrated Device Technology, Inc. (IDT®), the Analog and Digital Company™ delivering essential mixed-signal semiconductor solutions, today announced that it has earned a Product of the Year award from Electronic Products Magazine and a 2012 Best Electronic Design award from Electronic Design Magazine for its NVM Express (NVMe) enterprise flash memory controller with native support for PCIe® Gen 3.
Answering the question, "How low can you go with power?" Texas Instruments Incorporated (TI) today introduced the industry's lowest power DC/DC step-down converter, which increases the amount of harvested energy an end application can use as much as 70 percent over alternative devices. The ultra-low power circuit enables battery-free power to applications, such as wireless sensor networks, monitoring systems, smoke detectors, wearable medical devices and mobile accessories.
Universal Electronics Inc. (UEI), a worldwide leader in universal remote control technologies and control interfaces, is bringing the latest innovations in universal control and accessories for connected home entertainment to CES 2013.
Each Sunday in January, the Museum of Science is presenting an inside look at MC10’s virtually invisible, conformal electronics technology. Part of its Invented Here! program, the Museum of Science is celebrating MC10 as one of New England’s most innovative companies.
The global market for embedded and standalone non-volatile RAM is poised for explosive growth in the next few years. Magnetoresistive random-access memory (MRAM) and other non-charge storage-based memories including FeRAM continue to outperform charge-based semiconductor storage technologies such as SRAM, DRAM, NOR flash and NAND; but one challenge remains at the forefront: scalability and commercialization. Recent announcements, such as Toshiba's new STT-MRAM prototype, mark a shift in MRAM as in-plane technology is replaced by perpendicularly magnetization methods. The latter uses significantly less current and is capable of functioning on smaller transistor sizes.
Tessera Technologies, Inc. (the “Company” or “we”) announced today that its Tessera, Inc. and Invensas Corporation subsidiaries each entered into new eight-year patent license agreements with SK hynix Inc.
Almost all computer chips use two types of transistors: one called p-type, for positive, and one called n-type, for negative. Improving the performance of the chip as a whole requires parallel improvements in both types.
The Technology Transition From Analogue CCTV Systems to IP-based Solutions is a Major Trend , and in India IP-based Surveillance Market is Expected to Grow at 45 Per Cent Year on Year
Cypress Semiconductor Corp. today announced that the International Trade Commission (ITC) has agreed to review the entire Initial Determination issued by Chief Administrative Law Judge Charles E. Bullock in the pending patent case between Cypress and GSI Technology. Cypress has asserted that GSI SRAMs infringe multiple Cypress patents.
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