Vishay Intertechnology, Inc. is now offering laboratory sample kits that put popular values for its precision MELF resistors at designers' fingertips to simplify prototyping and speed time to market for a wide range of electronic systems.
Imec, the Belgian nanoelectronics research center, and Synopsys, Inc., a global leader accelerating innovation in the design, verification and manufacturing of chips and systems, today announced that they have expanded their collaboration in the field of Technology Computer Aided Design (TCAD) to next-generation FinFET technology at 10-nm.
At this week’s IEEE International Electron Devices Meeting (IEDM 2012), imec addressed key challenges of scaling beyond silicon-channel finFETs. Imec showed that channel mobility can be boosted by growing non-Si channels on a strain relaxed buffer (SRB), and demonstrated excellent scalability potential of the technology. Moreover, imec revealed insight on the unique influence oxide trapping has on the gate stack mobility in High-Mobility Ge and III-V channels.
Imec announces that it has developed an ultra-thin hybrid floating gate cell with demonstrated functionality. The results, which are presented at this week’s 2012 IEEE International Electron Devices Meeting (IEDM, San Francisco, USA, December 10-12, 2012), are an important step for further scaling of NAND Flash technology towards the 10nm half pitch node and beyond.
The annual printed electronics award winners were announced at the IDTechEx Printed Electronics event this week in Santa Clara, California - the World's largest event on the topic.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and CEA-Leti, France's premier research and technology institute, announced that a team of ST and CEA-Leti researchers had received the 2012 Général Ferrié Award.
MeadWestvaco Corporation, a global leader in packaging and packaging solutions is showcasing its full lineup of packaging solutions for the consumer electronics industry at the 2013 International Consumer Electronics Show (CES) in Las Vegas from Jan. 8-11, 2012 in Room S218.
AMD today announced that it successfully amended its Wafer Supply Agreement (WSA) with GLOBALFOUNDRIES Inc.
Audience®, Inc., the leader in advanced voice and audio processing for mobile devices, today announced that the Audience earSmart eS305 processor was selected by BBK for the new vivo X1 smartphone.
Americans love their electronics, and millions will undoubtedly receive everything from flat-screen TVs and e-readers to video games and coffee makers this holiday season. Over time, even the best of these devices inexplicably stop working. Often it’s not worth the time and money to have them repaired, but the nagging question of “why” still lingers long after they’re thrown in the trash.
Terms
While we only use edited and approved content for Azthena
answers, it may on occasions provide incorrect responses.
Please confirm any data provided with the related suppliers or
authors. We do not provide medical advice, if you search for
medical information you must always consult a medical
professional before acting on any information provided.
Your questions, but not your email details will be shared with
OpenAI and retained for 30 days in accordance with their
privacy principles.
Please do not ask questions that use sensitive or confidential
information.
Read the full Terms & Conditions.