Research and Markets has announced the addition of the "Global Sapphire Market In Semiconductors by Growth Technologies, Substrate Wafer, Devices, Applications, and Geography- Analysis & Forecast (2013-2020)" report to their offering.
Aehr Test Systems, a leading supplier of semiconductor test and burn-in equipment, today announced it has received over $1.5 million in follow-on orders for WaferPak full-wafer contactors for its FOX-1 and FOX-15 wafer-level burn-in and test systems.
Cree, Inc. introduces the new CPW5 Z-Rec® high-power silicon-carbide (SiC) Schottky diodes, the industry’s first commercially available family of 50 Amp SiC rectifiers. Designed to deliver the cost reduction, high efficiency, system simplicity and improved reliability of SiC technology to high power systems from 50kW to over 1MW, these new diodes can address demanding applications that include solar / PV inverters, industrial power supplies, induction heating, battery charging stations, wind turbine converters and traction inverters.
Silicon Labs, a leader in high-performance, analog-intensive, mixed-signal ICs, today announced the purchase of the full product portfolio and intellectual property of California-based Touchstone Semiconductor Inc., an early-stage power management technology company and provider of high-performance, low-power analog IC products. Silicon Labs purchased the assets of Touchstone for $1.5 million.
Research and Markets has announced the addition of the "Global Wafer Level Packaging Inspection Systems Market 2014-2018" report to their offering.
Raytheon Company announced today that under the DARPA Microsystems Technology Office (MTO) Wide Bandgap Semiconductor Program, the company has systematically matured Gallium Nitride (GaN) from basic material to transistors, Monolithic Microwave Integrated Circuits (MMICs), Transmit/Receive (T/R) Modules and finally Transmit/Receive Integrated Multichannel Modules (TRIMMs), enabling game changing system performance for the DoD.
Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, and Jiangsu Changjiang Electronics Technology Co., Ltd., the largest packaging service provider in China, jointly announced today a joint venture for 12" bumping and related testing.
Research and Markets has announced the addition of the "Global Chemical Vapor Deposition Market 2014-2018" report to their offering.
SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, today announced the launch of its newest generation ELP300 Excimer Laser Stepper. This latest generation product provides a means to directly create vias (< 5µm) and microstructures, addressing the limitations of traditional photo-dielectrics and photolithography steppers for Advanced Packaging and 3D processing applications.
M Cubed Technologies, Inc. a subsidiary of II-VI Incorporated, announces the release of its industry leading MESA™ product family of advanced flatness semiconductor wafer chucks and wafer tables. MESA™ technology will control flatness and surface finish of wafer handling components to tighter tolerances than previously available.
Terms
While we only use edited and approved content for Azthena
answers, it may on occasions provide incorrect responses.
Please confirm any data provided with the related suppliers or
authors. We do not provide medical advice, if you search for
medical information you must always consult a medical
professional before acting on any information provided.
Your questions, but not your email details will be shared with
OpenAI and retained for 30 days in accordance with their
privacy principles.
Please do not ask questions that use sensitive or confidential
information.
Read the full Terms & Conditions.