Leading semiconductor test equipment supplier Advantest Corporation has received an order from the engineering group within HiSilicon Technologies Co., Ltd., a Chinese producer of application-specific integrated circuits (ASICs) and other chipsets for communication networks and digital media, for a V93000 Smart Scale™ tester equipped with Advantest's Pin Scale Serial Link (PSSL) digital channel card.
Kulicke and Soffa Industries, Inc. ("Kulicke & Soffa", "K&S" or the "Company") today announced the expansion of its Advanced Copper Solution (ACS) Series Capillaries, with the addition of ACS MaxTM and ACS LiteTM.
Teradyne, Inc. announced that EDN, part of UBM Tech's portfolio of communities for the electronics industry, has honored the J750Ex-HD with a 2014 Best in Test award. The winners are selected online by the EDN community.
EpiGaN, a leading provider of III-nitride epitaxial material solutions, announced today that Dr. Marianne Germain, CEO and co-Founder, will deliver a presentation at the CS International Conference 2014 in Frankfurt, Germany.
Microsemi Corporation, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its IGLOO®2 FPGA family has won the DesignVision Award in the Semiconductor Components category at the 2014 DesignCon conference.
Research and Markets has announced the addition of the "Concise Analysis of the International Semiconductor Foundry Market - Forecasts to 2016" report to their offering.
What does it take to make it to 80 years in an industry where today’s technology is obsolete tomorrow? For Indium Corporation, it takes foresight and dedication.
Leading semiconductor test equipment supplier Advantest Corporation has extended its V93000 capabilities with the introduction of its new DPS128HV module, a high-density device power supply (DPS) unit designed to handle a wide range of operating voltages for testing devices such as eFlash memory ICs.
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"), a leading provider of advanced semiconductor packaging and test services, has designed and implemented an innovative new manufacturing method that is a significant paradigm shift from conventional wafer level manufacturing. This breakthrough approach, known as FlexLine™, delivers an unmatched level of flexibility and cost savings for wafer level packaging (WLP).
Dr. Ali Shakouri, Microsanj Co-founder and Chairman of the Advisory Board, has been selected to be the SEMI-THERM 2014 recipient of the THERMI award in recognition of his contributions to the field of semiconductor device and systems thermal issues.
Terms
While we only use edited and approved content for Azthena
answers, it may on occasions provide incorrect responses.
Please confirm any data provided with the related suppliers or
authors. We do not provide medical advice, if you search for
medical information you must always consult a medical
professional before acting on any information provided.
Your questions, but not your email details will be shared with
OpenAI and retained for 30 days in accordance with their
privacy principles.
Please do not ask questions that use sensitive or confidential
information.
Read the full Terms & Conditions.