Vishay Intertechnology, Inc. today released a new n-channel TrenchFET® power MOSFET in the thermally enhanced PowerPAK® SO-8 package that extends the company's ThunderFET® technology to 150 V.
United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced the three-year plan to improve resource and energy productivity and to reduce greenhouse emission.
ATMI, Inc., a global technology company and leader in single-use bioprocess solutions, today announced that its proprietary helium integrity testing (HIT™) system has been made available to end-users for on-site application.
Like spreading a thin layer of butter on toast, Cornell scientists have helped develop a novel process of spreading extremely thin organic transistors, and used synchrotron X-rays to watch how the films crystallize.
Aetrium Incorporated today introduced a new Wafer Level Reliability (WLR) test platform to its portfolio of reliability test products, which are used by semiconductor manufacturers and wafer foundries to ensure their products exceed acceptable performance and quality standards.
United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced that it has received ISO 22301 certification for its business continuity management (BCM) system from SGS (Societe Generale de Surveillance).
Leading semiconductor test equipment supplier Advantest Corporation has earned the Texas Instruments (TI) 2012 Supplier Excellence Award. Advantest provides the M4841 pick-and-place test handler, which TI uses with its installed automated test equipment (ATE). This is the first time that Advantest has received this supplier award from TI.
Applied Materials, Inc. has been recognized as one of 17 companies receiving Intel Corporation's Preferred Quality Supplier (PQS) award for their performance in 2012. Applied Materials is recognized for its significant contributions providing Intel with semiconductor equipment, software and support services deemed essential to Intel's success.
Thermal Engineering Associates, Inc. (TEA) announces that it is now accepting wafer orders for its new 1mm square Thermal Test Chip (TTC-1001). This new chip has many of the same advantages as the popular TEA TTC-1002 (2.5mm square) TTC. The TTC-1001 may be arrayed in many ways to create square or rectangular devices in increments of 1mm.
Plessey announced that samples of its Gallium Nitride (GaN) on silicon LED products (p/n PLW111010) are available today. These entry level products are the first LEDs manufactured on 6-inch GaN on silicon substrates to be commercially available anywhere in the world.
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