SUSS MicroTec Launch Next Generation Ground Breaking Wafer Bonding Technology

SUSS MicroTec, a leading supplier of precision manufacturing and test equipment for the semiconductor and related markets, announced today the launch of the company’s next generation, ground breaking wafer bonding technology. Called the ELAN CB8, it is based on an entirely new design platform and is capable of achieving “best-in-class” across a wide range of performance parameters.

The elite performance package offered by the ELAN CB8 includes superb force and temperature uniformity (±5% and ±1°% respectively) as well as a super clean, high-vacuum environment to improve yield even in the most critical applications. The ELAN CB8 also boasts rapid heat up and cool down times, maximizing productivity for wafer bonding customers.

The ELAN CB8 integrates a number of innovative and patented technologies to deliver breakthrough performance for the most critical applications. Pressure Column Design ensures the ultimate in pressure uniformity, and is confirmed via load cell verification. SUSS is also the only company to develop and package a Wedge Error Compensation (WEC) function into its wafer bonders, which ensures true planarity before every single bond. Vacuum isolated heaters allow heat to be directed exactly where it is needed – at the wafer – while the silicon nitride heater material provides superior strength and conduction over time and under elevated temperatures. Finally, an extremely rigid 3-post load-bearing, superstructure frame evenly and predictably supports the extremely high forces required for many bonding processes.

“The ELAN CB8 semi-automated wafer bonder from SUSS represents the next level of tool performance and capabilities for high-precision, high-yield wafer bonding,” said Dr. Amir Mirza, International Product Manager for Wafer Bonders, SUSS MicroTec. “The breakthrough technologies that form the basis of the ELAN CB8 are a testament to SUSS’ core competence in engineering and design, as well as our commitment to wafer bonding. We are clearly advancing wafer bonding technology with these innovations and expanding the potential for MEMS device manufacturing and emerging markets such as 3-D Interconnects.”

For over 10 years, SUSS MicroTec has continued to advance the State-of-the-Art in wafer bonding technology for the MEMS, SOI, 3-D interconnect, and Opto-Electronic markets, setting new standards for development as well as high-volume production. The company’s core competence – engineering and design – is constantly leveraged to develop technology solutions that most effectively support standard bonding processes as well as the most critical, leading-edge applications. SUSS MicroTec’s wafer bonding solution set includes manual, semi-automated, and fully automated cluster systems.

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