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New Method to Build Cost-Effective Electronics that Recharge out of Thin Air

Electronics that use small amounts of power are crucial for the progress of the Internet of Things, where real-world objects are linked to the internet.

14 Oct 2020

Techsil & Panacol Offer a New Adhesive for Filament Winding Processes

The newly developed Vitralit® UD 1405 adhesive is an innovative adhesive system for fibre and filament winding. For high efficiency, Vitralit® UD 1405 can be applied during the winding process and immediately cured with high intensity LED curing systems.

14 Oct 2020

Indium Corporation Announces Low-Temp Solder Seminar at LEAP Expo

Indium Corporation’s Anson Yu, Technical Manager for Global Accounts in Asia, will present at the LEAP Expo, November 3-5 in Shenzhen, China.

From Indium Corporation 14 Oct 2020

J.A. Woollam Collaborates with Linkam Scientific to Bring Precise Temperature Control to its Ellipsometry Instruments

Worldwide leader in spectroscopic ellipsometry, J. A. Woollam, has worked closely with Linkam Scientific to bring precise temperature control to its custom ellipsometry instruments.

From Linkam Scientific Instruments 14 Oct 2020

Forge Nano and Nouveau Monde Collaborate to Optimize Battery Technology at the Atomic Level

Nouveau Monde Graphite Inc., Quebec, Canada, and Forge Nano Inc., based in Colorado, have signed a collaboration agreement for the use of Forge Nano’s proprietary Atomic Layer Deposition coating technologies (“ALD”). Forge Nano’s surface engineering platform technology will be used to apply atomic level coatings to Noveau Monde’s graphite material.

From Forge Nano 14 Oct 2020

Dalian University of Technology Uses SwiftComp Software for Morphing Honeycomb and Corrugated Sandwich Structures

AnalySwift, LLC, a provider of efficient high-fidelity modeling software for composites, announced today that Dalian University of Technology is participating in its recently launched Academic Partner Program, and it is using its SwiftComp and VABS simulation software for researching composite structures.

From AnalySwift, LLC 14 Oct 2020

Hitachi High-Tech Analytical Science introduces next generation SpArcfire software to its mobile OES analyzer range

Hitachi introduces next generation software to its OES analyzer range

From Hitachi High-Tech Analytical Science 13 Oct 2020

Hybrid Surface Waves can Conduct Heat Away from Nanoscale Material Structures

The continuing progress in miniaturization of silicon microelectronic and photonic devices is causing cooling of the device structures to become increasingly challenging.

13 Oct 2020

'Multi-State Memory' Data Storage Steps Beyond Binary to Store More Data

Electronic data is being produced at a breath-taking rate.

13 Oct 2020

Tetrahedral Structures may Explain Water's Special Qualities

Researchers at the Institute of Industrial Science at The University of Tokyo sifted through experimental data to probe the possibility that supercooled water has a liquid-to-liquid phase transition between disordered and tetrahedrally structured forms.

13 Oct 2020